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Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board

A technology of polyimide film and manufacturing method, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of high adhesive strength, inability to obtain, and inability to obtain peel strength laminates, etc., to achieve close adhesion excellent effect

Inactive Publication Date: 2009-10-07
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyimide films have problems in adhesiveness, and when bonded to metal foils such as copper foil with heat-resistant adhesives such as epoxy resin adhesives, sufficient adhesive strength may not be obtained.
In addition, even if a metal layer is provided on the polyimide film by metal vapor deposition or sputtering, a laminate with sufficient peel strength may not be obtained.

Method used

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  • Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board
  • Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board
  • Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board

Examples

Experimental program
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Effect test

Embodiment

[0144] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.

[0145] (Evaluation method)

[0146] The amount of aluminum on the surface of the polyimide film was measured with a Quantum 2000 scanning X-ray photoelectron spectrometer manufactured by PHI Corporation.

[0147] In the observation of the surface of the polyimide film using an electron microscope, after the observation surface of the polyimide film was treated with a metal oxide, the JSM-6460LA electron microscope manufactured by JEOL Ltd. was used at an accelerating voltage of 10 kV, 1×10 -3 Carry out under the vacuum degree of MPa.

[0148] Regarding the mechanical strength of the polyimide film, using a sample with a width of 4 mm, TENSILON (Tensilon) AR6000 series manufactured by Orientec Corporation, a universal tensile testing machine UTM-II-20, and a flat type automatic balance recorder R-840 were used, The measu...

reference example 1

[0151] (Preparation of Coating Solution)

[0152] Weigh 3.80 g of tris(ethyl acetoacetate) aluminum, 0.20 g of ethyl acetoacetate·aluminum diisopropoxide (ALCH), 0.03 g of water, and organosilicon surfactant (Toray Dow Corning Corporation) in a sample bottle. Prepare 0.10 g of FZ-2101) and 96.00 g of N,N-dimethylacetamide (DMAc), stir until uniform, and obtain coating liquid 1.

reference example 2～12

[0154] (Preparation of Coating Solution)

[0155] Coating solutions 2 to 12 having the compositions shown in Table 1 were obtained in the same manner as in Reference Example 1.

[0156]

[0157] In the table, ALCH-TB is R in chemical formula (1) 1 , R 2 , R 3 Aluminum chelate manufactured by Kawaken Seika Co., Ltd. is ethyl or isobutyl, ALCH is ethyl acetoacetate·aluminum diisopropoxide, EG is ethylene glycol, DMAc is N,N-dimethylacetamide , IPA is isopropanol.

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Abstract

The present invention provides a polyimide film having excellent adhesive properties, sputtering property, metal vapor deposition property and metal plating property, and excellent surface smoothness, while maintaining the excellent properties of a polyimide film. Another objective of the present invention is to provide a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing aluminum chelate compound and, optionally, a nonionic surfactant and / or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization.

Description

technical field [0001] The present invention relates to a polyimide film having improved adhesiveness and excellent surface smoothness, and a method for producing the same. The present invention also relates to a polyimide metal laminate and a polyimide circuit board using the polyimide film. Background technique [0002] Polyimide films are widely used in electronic devices because of their excellent thermal properties and electrical properties. [0003] However, polyimide films have problems in adhesiveness, and when bonded to metal foils such as copper foil with heat-resistant adhesives such as epoxy resin adhesives, sufficient adhesive strength may not be obtained. In addition, even if a metal layer is provided on a polyimide film by metal vapor deposition or sputtering, a laminate having a sufficiently high peel strength may not be obtained. [0004] In addition, in Patent Document 1, as a polyimide film with improved adhesiveness (including sputtering property and me...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08J7/12C08L79/08B32B15/08H05K1/02H05K1/03
Inventor 幸田政文山口裕章山根俊文
Owner UBE IND LTD
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