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Method for printing black soldermask on PCB board

A solder mask and black technology, applied in the field of PCB board manufacturing process, can solve problems such as not enough black color, red solder mask, affecting product appearance, etc.

Active Publication Date: 2009-09-30
SHENZHEN BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are yellow, green and black solder masks. As a commonly used solder mask, black solder mask is usually used on the PCB board of some high-end products to show its noble characteristics due to its visual effect different from the commonly used green solder mask. , but in actual operation, the black solder mask is printed on the copper surface of the circuit, which is prone to redness of the solder mask, which affects the appearance of the product, and the color is often not black enough

Method used

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Embodiment Construction

[0019] The present invention will be further elaborated below by describing the specific steps of printing black solder resist on the PCB.

[0020] First of all, in order to improve the adhesion of the copper surface when it is covered with solder resist, it is necessary to grind the copper surface. The grinding methods include mechanical grinding methods such as brush grinding and micro-etching (chemical grinding) methods. Especially when processing substrates with fine lines, microetching is used.

[0021] After the copper surface is ground clean, it is necessary to brown the copper surface. The above-mentioned browning treatment solution for browning is mainly composed of benzotriazoles, mixed with sulfuric acid, hydrogen peroxide, halogen ions and water-soluble polymers, etc., to make a weak acid solution, and evenly spread on the copper surface A layer of brown-black film was formed. The film has two functions: one is to form an organic metal film with the copper surfac...

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Abstract

The invention relates to a process for manufacturing a PCB board, in particular to a method for printing black resistance weld on a PCB board. The method comprises the followings steps: firstly, treating the copper surface by a grind plate, and cleaning the copper surface; performing brown oxide on the copper surface to form a layer of organic metallic membrane on the copper surface; thirdly, drying the board after the brown oxide and performing black soldermask print; transferring a soldermask pattern; solidifying the soldermask by roasting; and removing the browning membrane on the soldermask window. By coating a layer of membrane on the copper surface, the soldermask redness caused by printing the black soldermask on the copper surface is avoided, the product appearance is better improved, particularly after the contrast influence of the redness on the surface of the PCB board printed with the black soldermask is eliminated, and the product is more noble and beautiful. In addition, the coating can also improve the bonding force between the soldermask and the board. Therefore, the method is simple and feasible, and has a great number of advantages.

Description

Technical field: [0001] The invention relates to a manufacturing process of a PCB board, in particular to a process method for printing black solder resist on a PCB board. Background technique: [0002] PCB is the abbreviation of English (Printed Circuie Board) printed circuit board. Usually, on the insulating medium, according to the predetermined design, the conductive pattern made of printed circuit, printed component or a combination of the two is called printed circuit. The conductive pattern that provides electrical connection between components on an insulating substrate is called a printed circuit. In this way, the finished board of printed circuit or printed circuit is called printed circuit board, also known as printed board or printed circuit board. [0003] Soldering is a necessary process for the production of PCB boards. The function of soldering is to prevent the parts that should not be soldered from being connected by solder. Wave soldering is realized by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
Inventor 黄李海杨泽华
Owner SHENZHEN BOMIN ELECTRONICS
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