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Metal surface treatment agent and printed wiring board with protecting film formed thereby

A metal surface treatment and function technology, applied in the direction of coating non-metallic protective layer, metal material coating process, printed circuit secondary treatment, etc., can solve the problem of inability to strengthen the oxidation resistance of exposed copper surface, metal ion complexation, etc. question

Inactive Publication Date: 2009-09-09
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a kind of novel metal surface treatment agent, it has overcome traditional oxidizing agent and metal ion (as copper ion), the complexation of imidazole compound, can't be deposited in the organometallic polymer film (OSP) together, thus The disadvantage of being unable to strengthen the oxidation resistance of the exposed copper surface in the subsequent soldering process of the PCB, so that a certain proportion of anti-oxidation substances (non-entrainment) are embedded in the formed organometallic polymer film, thus eliminating the need for existing imidazoles Or the modification of the structure of benzimidazole derivatives can improve the heat resistance temperature and heat resistance performance of the corresponding OSP film, reaching the standard required in the subsequent soldering process of PCB

Method used

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  • Metal surface treatment agent and printed wiring board with protecting film formed thereby
  • Metal surface treatment agent and printed wiring board with protecting film formed thereby
  • Metal surface treatment agent and printed wiring board with protecting film formed thereby

Examples

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Effect test

Embodiment 1

[0044] The components and the content of each component of the OSP aqueous solution treatment agent of embodiment 1 are shown in Table 1.

[0045] In Example 1, the composition described in Table 1 was dissolved in deionized water, and the pH was adjusted to 3.0 with ammonia water, thereby preparing a metal surface treatment agent. Then, degrease the test piece of the printed circuit board (as a circuit diagram, formed by 10 copper foils of 40×0.7mm, each copper foil is 1mm apart in the width direction), wash with water, and do it in sulfuric acid / hydrogen peroxide. Soak in the microetching agent for 60-120 seconds, wash 3 times with deionized water, dry, soak in 3-5% hydrochloric acid aqueous solution for 15-30 seconds, wash 3 times with deionized water, dry, and place in a surface treatment agent at 40°C Soak for 60 seconds, dry, wash with deionized water 3 times, and dry to form a 0.1-0.5 micron protective film on the surface of the circuit board.

Embodiment 2-10

[0047] A metal surface treatment agent having a composition described in Table 1 was prepared in the same manner as in Example 1. The printed circuit board was treated with the same process as in Example 1, and then the protective film on the PCB was prepared under the conditions recorded in Table 1.

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Abstract

The invention relates to a metal surface treatment agent which is used for protecting the surface of metal from being oxidized, improving the solderability of the metal and providing a protective coating for the copper surface of a printed circuit board (PCB), and a printed wiring board with a protecting film formed by applying the treatment agent. The surface treatment agent contains azole compound, organic acid, cupric compound, zinc compound, iron compound and aqueous solution of the compounds having antioxidant effect; wherein, the compounds having antioxidant effect are calixarenes compound and thiacalixarenes compound which have the structure in formula (1), and can be sedimentated on the surface of the metal together with imidazole and metallic ions to form the protecting film. In the formula (1), R1 is SO3<->, COO<->or tert-butyl group, and R2 is S, SO or SO2.

Description

technical field [0001] The present invention relates to a metal surface treatment agent, in particular to a metal surface treatment for protecting the metal surface from oxidation and enhancing its solderability, providing a protective coating for the copper surface of a printed circuit board (PCB) agent. The present invention also relates to a printed wiring board to which the treating agent is applied to form a protective film. Background technique [0002] In recent years, high-density surface mount technology has been widely used in PCBs. This technology requires multiple soldering of PCBs in the manufacturing process, causing the PCBs to experience multiple high temperatures, which accelerates the formation of oxide films on the surface of copper or copper alloys in PCBs. Therefore The good solderability of the copper surface cannot be maintained, which greatly increases the defect rate of the subsequent soldering process. In order to protect the copper wiring part of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/05H05K3/28
Inventor 黄艳陈群郭丹卢志云谢明贵
Owner SICHUAN UNIV
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