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Method for preparing electroforming copper metallographical example and display texture

An electroforming and sample technology, applied in the field of preparing electroformed copper metallographic samples, can solve problems such as little research, and achieve the effect of clear microstructure, solving difficult corrosion, and eliminating false structure.

Inactive Publication Date: 2009-08-19
UNIV OF SCI & TECH BEIJING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

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Method used

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  • Method for preparing electroforming copper metallographical example and display texture
  • Method for preparing electroforming copper metallographical example and display texture
  • Method for preparing electroforming copper metallographical example and display texture

Examples

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Embodiment Construction

[0016] Divide the samples into 16 groups (Table 3), and first rough grind to 1000 # Silicon carbide water sandpaper, the force should be light, the speed of the grinding disc should be slow, about 300-500rpm; the roughly ground sample should be cleaned in an ultrasonic instrument, and polished on a polishing flannelette. At this time, use 1μm diamond polishing agent , using ethanol as a lubricant. After polishing for about 5 minutes, observe the surface state under a microscope to confirm that the surface scratches are along one direction. Clean the ground sample in an ultrasonic instrument, replace it with a 0.5 μm diamond polishing agent, and use ethanol as a lubricant. After polishing for about 5 minutes, observe the surface state under a microscope to confirm that the surface scratches are along one direction. Then carry out electrolytic polishing, the electrolyte composition of electrolytic polishing is 80% H 3 PO 4 and 20% H 2 O, on this basis and then chemically et...

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Abstract

The invention relates to a method for preparing electrocasting copper-gold phase samples and displaying structure, belonging to the technical field of preparation of gold phase samples. The method comprises the following steps: the electrocasting copper sample is processed by rough grinding to 1000silicon carbide waterproof abrasive paper, then polishing is carried out, the surface state is observed under a microscope, the surface scratch is determined along one direction and electrolytic polishing is carried out to the polished electrocasting copper sample; the composition of the electrolyte is H3PO4 solution with the volume fraction of 80 percent to 90 percent; the temperature is 15 to 20 DEG C, the current density is 6 to 8A / dm, the voltage is 1.5 to 1.8 V, and the processing time is 10 to 15s; then the sample is immersed or wiped for erosion; and the formulation of an erodent comprises FeCl3, HCl and H2O with the proportion of 1:2:20. The method effectively solves the problem of the electrocasting copper caused by soft texture, can basically get rid of the surface stress generated in the polishing process and clearly display electrocasting copper-gold phase microscopic structure.

Description

Technical field: [0001] The invention belongs to the technical field of metallographic sample preparation, is used for preparing metallographic samples of electroformed copper, and is a technology that is easy to operate and can clearly display the metallographic structure of electroformed copper. Background technique: [0002] Copper is a soft metallic material and deformation-induced damage is a common problem in the purer components. When preparing metallographic samples, considerable surface flow and deformation will occur during the grinding and polishing process, and these deformed structures will cover up the real structure and cause false images, which will bring difficulties to the preparation of metallographic samples. After preparation, a strong protective oxide layer tends to form on the surface, which makes corrosion difficult. According to the data (Hong Bo, Jiang Chuanhai, Wang Xinjian. Internal stress and texture characteristics in the electrodeposited coppe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/32
Inventor 黄志涛田文怀苏永安李春华成生伟王雷
Owner UNIV OF SCI & TECH BEIJING
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