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Method for preparing polyamide-imide enamelled wire varnishes

A technology of polyamide-imide and enameled wire varnish, applied in the direction of coating, etc., can solve the problems of cumbersome steps, unstable storage, large solvent consumption, etc., and achieve the effect of simple operation and short process flow

Inactive Publication Date: 2009-04-01
BAOSHAN IRON & STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Based on the above-mentioned background technology content, in order to overcome the shortcomings of large molecular weight of PAI, long synthesis process route, cumbersome steps, high viscosity of paint liquid, large solvent consumption and unstable storage in the process of synthesizing polyamide-imide wire enamel, this paper is proposed. invention

Method used

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  • Method for preparing polyamide-imide enamelled wire varnishes
  • Method for preparing polyamide-imide enamelled wire varnishes
  • Method for preparing polyamide-imide enamelled wire varnishes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Synthesis of polyamide-imide wire enamel with high temperature resistance

[0026] Add 125 grams (0.50 moles) of solid 4,4-diphenylmethane diisocyanate into a flask with a condenser, stirrer and thermometer, heat to dissolve, and wait until 4,4-diphenylmethane diisocyanate is completely dissolved After adding 371 grams (3.75 moles) of polar solvent N-methyl-2-pyrrolidone and 96 (0.50 moles) of trimellitic anhydride, react at low temperature for a certain period of time and then slowly rise to a specific temperature, until the end of the reaction, cool down Then add 110 g (1.50 moles) of N,N-dimethylformamide for dilution to generate a brown transparent liquid.

Embodiment 2

[0028] Synthesis of polyamide-imide wire enamel with high temperature resistance

[0029] Add 125 grams (0.50 moles) of solid 4,4-diphenylmethane diisocyanate into a flask with a condenser, stirrer and thermometer, add 396 grams (4.00 moles) of N-methyl-2- Add 100 grams (0.52 moles) of pyrrolidone to the trimellitic anhydride for a certain period of time, then slowly heat up to the end of the reaction, add 120 grams (1.64 moles) of N, N-dimethylformamide after cooling to dilute, and generate a brown transparent liquid.

Embodiment 3

[0031] Synthesis of polyamide-imide wire enamel with high temperature resistance

[0032] Add 125 grams (0.50 moles) of solid 4,4-diphenylmethane diisocyanate into a flask with a condenser, stirrer and thermometer, and add 247 grams (2.49 moles) of N-methyl-2-diisocyanate after heating to dissolve. Pyrrolidone, then add 83 grams (0.43 moles) of trimellitic anhydride to react for a certain period of time, slowly heat up to the end of the reaction, add 164 grams (2.25 moles) of N,N-dimethylformamide after cooling to dilute, and generate a brown transparent liquid.

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Abstract

The invention relates to a wire enamel technology, in particular to the wire enamel with high temperature resistance. The invention provides a method for synthesizing polyamide-imide wire enamel by adopting trimellitic anhydride and isocyanate to react in a polar solvent. The mixture ratio of materials MDI and TMA used by the method can be: MDI / TMA equal to 1:0.85 to 1.05, the addition of solvent used by the method is: MDI / solvent equal to 1:5.0 to 10.0, and the mixture ratio of added diluent can be: MDI / diluent equal to 1:1.5-4.5. The reaction process of the invention does not need catalyst, and the cyclization can be completed without curing agents in the muffle furnace process. The technology of the invention has short process flow and simple operation, and the synthetic PAI solution is characterized by low viscosity and stable storage.

Description

technical field [0001] The invention relates to insulating paint technology and wire enamel technology, in particular to a synthesis method of wire enamel-polyamideimide wire enamel with high temperature resistance. Background technique [0002] Polyamide-imide wire enamel is an enameled wire enamel with polyamide-imide as the base material resin and a heat-resistant temperature of 200°C, which belongs to insulating coatings. [0003] Polyamide-imide (PAI) is a thermoplastic resin with heat-resistant heteroimide groups and flexible amide groups in the molecule, so it has excellent heat resistance, dielectric properties, mechanical properties and chemical properties. Stability is an engineering material with excellent performance, especially widely used in the electrical industry. [0004] Polyamide-imide wire enamel is a kind of high temperature resistant wire enamel with excellent comprehensive performance, and it is one of the main varieties of 200 grade and above high te...

Claims

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Application Information

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IPC IPC(8): C09D179/08
Inventor 周玉青陶兰芬
Owner BAOSHAN IRON & STEEL CO LTD
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