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Pig tin series leadless alloy soldering paste and preparation method thereof

A lead-free alloy and solder paste technology, used in welding equipment, metal processing equipment, welding media, etc., can solve the problems of easy oxidation, poor quality of solder joints, and inability to form solder joints. , to avoid the effect that the solder joint cannot be formed

Inactive Publication Date: 2009-03-11
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The existing Sn-Zn solder paste is easily oxidized during the SMT process, and has the disadvantages of being unable to form solder joints or having poor solder joint quality

Method used

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Examples

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preparation example Construction

[0048] The preparation method of solder paste of the present invention, carries out according to the following steps:

[0049] Step 1: Preparation of Solder Alloy

[0050] According to weight percentage, take 8%~10% of zinc, 0.005%~1.0% of rare earth elements, 0.001%~0.1% of aluminum and tin respectively. ;

[0051] Step 2: Preparation of Solder Alloy Powder

[0052] Using nitrogen as the atomizing gas, place the solder alloy prepared in step 1 under the conditions of a pressure of 0.5-1.0 MPa and a temperature of 400-500°C, and adopt a supersonic gas atomization method to atomize to obtain an alloy powder. The alloy powder is screened to produce solder alloy powder with a particle size of less than 74 μm.

[0053] Step 3: Prepare Flux

[0054] According to weight percentage, 15%-60% of modified rosin, 3%-20% of active agent, 1%-10% of paste forming agent, 2%-10% of thixotropic agent, 0.1%-3% of corrosion inhibitor, additive 0.1% to 8% and solvent, the total amount of eac...

Embodiment 1

[0058] According to weight percentage, take 0.001% of aluminum, 0.005% of lanthanum, 8% of zinc and 91.994% of tin, mix them evenly, put them in an environment with a temperature of 600°C and nitrogen protection, and obtain solder alloys, using supersonic gas atomization method , using nitrogen as the atomizing gas, place the solder alloy in an environment with a pressure of 0.5MPa and a temperature of 400°C, atomize to obtain alloy powder, and screen the alloy powder to obtain a solder alloy with a particle size of less than 74 μm powder; take ethylene glycol butyl ether, diethylene glycol butyl ether and ethylene glycol respectively, and prepare them as organic solvents; take water white rosin and hydrogenated rosin respectively, and prepare modified rosins; take succinic acid, oxalic acid, Sebacic acid and dimethylamine hydrochloride are made into activator, and the weight of dimethylamine hydrochloride accounts for 0.01% of the total weight of activator in this activator, t...

Embodiment 2

[0060] According to the weight percentage, take 0.1% of aluminum, 1% of cerium, 10% of zinc and 88.9% of tin respectively, mix them evenly, put them in the smelting at a temperature of 600°C under nitrogen protection environment, and obtain the solder alloy, and adopt the supersonic gas atomization method , using nitrogen as the atomizing gas, place the solder alloy in an environment with a pressure of 1.0 MPa and a temperature of 500°C, atomize to obtain alloy powder, and pass the alloy powder through screening to obtain a solder alloy with a particle size of less than 74 μm Powder; take ethylene glycol butyl ether and diethylene glycol respectively to make organic solvents, take disproportionated rosin and gum rosin respectively to make modified rosin, take malonic acid, adipic acid, sebacic acid and dimethyl Amine hydrochloride is made into activator, and the weight of dimethylamine hydrochloride accounts for 0.8% of the total weight of activator in this activator, then, by ...

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Abstract

The invention discloses a tin-zinc series lead-free alloy soldering paste and a manufacturing method thereof. According to the weight percentage, the tin-zinc series lead-free alloy soldering paste consists of 85 to 90 percent of solder alloy powder as well as 10 to 15 percent of scaling powder; wherein, the solder alloy powder consists of 8 to10 percent of zinc, 0.005 to 1.0 percent of rare earth element, 0.001 to 0.1 percent of aluminum as well as tin according to the weight percentage; the total amount of each component is 100 percent; wherein, the scaling powder consists of 15 to 60 percent of modified rosin, 3 to 20 percent of activator, 1 to 10 percent of paste forming agents, 2 to 10 percent of thixotropic agents, 0.1 to 3 percent of azimino-benzene, 0.1 to 8 percent of trichloride isocyanuric acid as well as organic solvent according to the weight percentage; the total amount of each component is 100 percent. The solder alloy powder and the scaling powder are respectively prepared and then mixed uniformly for preparing the tin-zinc series lead-free soldering paste. The lead-free soldering paste has excellent wettability, is hard to be oxidized, has good welding performance and is suitable for an SMT technique flow.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a welding material for welding electronic components, in particular to a tin-zinc lead-free alloy solder paste, and also relates to a preparation method of the alloy solder paste. Background technique [0002] With the emergence of microelectronic components and high-density fine-pitch integrated circuit chips, surface mount technology SMT has developed rapidly, and has completely replaced traditional electronic assembly technology in many fields, becoming the mainstream technology for electronic product assembly, and to narrow pitch, High-density, high-precision, multi-functional, no-clean and lead-free development. [0003] Solder paste, as an important soldering material, is widely used in the surface assembly process. It has the functions of fixing electronic components, removing surface oxide film, and forming reliable solder joints. Its quality is directly relate...

Claims

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Application Information

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IPC IPC(8): B23K35/22B23K35/26B23K35/36
Inventor 赵麦群卢加飞吕娟李涛
Owner XIAN UNIV OF TECH
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