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Cleaning-free lead-free solder soldering fluid not containing halide

A lead-free solder, no-clean technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as physical and environmental hazards, failure of electronic product parts, etc., to enhance wetting force, material selection, etc. And design science, the effect of superior soldering

Active Publication Date: 2009-02-18
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Halogen-containing fluxes volatilize halogen-containing fumes during soldering, which will cause harm to the body and the environment, and the fumes will generate halogen acids after absorbing water, which will cause electronic product components to fail

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1: This is a completely halogen-free no-clean lead-free solder flux whose solvent is isopropanol, and its weight percentage is composed of:

[0024] Succinic acid 0.75

[0025] Adipic acid 0.65

[0026] Glycolic acid 0.50

[0027] Premium gum rosin 1.50

[0028] polymerized rosin 1.00

[0029] Polyacid modified rosin resin 0.50

[0030] Keto hydroxy acid SC-300 0.40

[0031] Nonylphenol polyoxyethylene ether NP-10 0.12

[0032] Silicone Surfactant AC-64 0.10

[0033] Oleic acid amide cationic surfactant SF-03 0.08

[0034] Butyl acetate 5.00

[0035] Isopropanol 89.40

[0036] Preparation method: at room temperature, add isopropanol into a clean enamel kettle with stirring, start stirring, first add succinic acid, adipic acid, glycolic acid and ketohydroxy acid SC-300, and stir for half an hour; then add special grade Gum rosin, polymerized rosin, and polybasic acid modified rosin resin, stirred for 1 hour, then added the rest of the raw materials i...

Embodiment 2

[0038] This is a completely halogen-free no-clean lead-free solder flux in absolute ethanol, the composition of which is by weight percent:

[0039] Succinic acid 0.85

[0040] Salicylic acid 0.65

[0041] Glycine 0.50

[0042] Keto hydroxy acid SC-200 0.45

[0043] Hydrogenated rosin 1.50

[0044] Disproportionated rosin 0.50

[0045] polymerized rosin 1.50

[0046] Fatty alcohol polyoxyethylene ether AEO 0.20

[0047] Silicone Surfactant AC-64 0.08

[0048] Oleic acid amide cationic surfactant SF-03 0.12

[0049] Imidazole 0.15

[0050] Mixed esters DEB 2.00

[0051] Propylene glycol methyl ether 3.00

[0052] Absolute ethanol 88.50

[0053] Preparation method: at room temperature, add absolute ethanol into a clean enamel kettle with stirring, start stirring, first add succinic acid, salicylic acid, glycine and keto hydroxy acid, and stir for half an hour; then add hydrogenated rosin and disproportionated rosin 1. Polymerize rosin, stir for 1 hour, then add the rem...

Embodiment 3

[0055] This is a completely halogen-free no-clean lead-free solder flux in absolute ethanol and deionized water, consisting of:

[0056] Malonic acid 0.40

[0057] Adipic acid 0.85

[0058] Sarcosine 0.50

[0059] Keto hydroxy acid SC-400 0.35

[0060] Keto hydroxy acid SC-200 0.15

[0061] Modified water-soluble rosin resin 1.00

[0062] Acrylic modified rosin 0.40

[0063] Triethanolamine 0.45

[0064] Nonylphenol polyoxyethylene ether NP-10 0.20

[0065] Silicone Surfactant AC-64 0.15

[0066] Oleic acid amide cationic surfactant SF-03 0.15

[0067] Ethylene glycol ether 4.00

[0068] Propylene glycol phenyl ether 3.00

[0069] Deionized water 38.00

[0070] Absolute ethanol 50.40

[0071] Preparation method: at room temperature, add deionized water and absolute ethanol into a clean enamel kettle with stirring, start stirring, first add malonic acid, adipic acid, sarcosine, ketohydroxyacid SC-400 and ketone Hydroxy acid SC-200, stir for half an hour; then add m...

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PUM

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Abstract

The invention discloses halogen-free cleaning-free soldering flux for lead-free solder, which comprises the compositions in percentage by weight: 1.5 to 4.5 percent of organic acid activator, 0.5 to 8.5 percent of high-quality abietic resin, 0.3 to 1.5 percent of activated reinforcer, 0.2 to 0.8 percent of surfactant, 3.0 to 15.0 percent of wet strengthening agent, and the balance being solvent isopropanol, absolute ethyl alcohol or deionized water. The soldering flux fully meets various regulation requirements for limiting halogen. The soldering flux developed by using a novel material which does not contain the halogen can scientifically reduce the surface tension of the lead-free solder, strengthen the wetting power of the lead-free solder, improve the solderability, can be compatible with a plurality of welding materials, and has no corrosion effect on lead-free solder alloy; composing materials are volatilized by stages during the welding process, so after the welding, the surface of a PCB board has less residue, even spread, less ion residue, and reliable electrical insulating property, and does not need to be washed; and the soldering flux is a novel environment-friendly halogen-free cleaning-free soldering flux for the lead-free solder.

Description

technical field [0001] The invention relates to a solder flux, which is a completely halogen-free, no-clean, lead-free solder flux. Background technique [0002] The halogens commonly used in flux are chlorine (Cl), bromine (Br), and fluorine (F). These halogen compounds have strong activity and can enhance the ability of flux to remove oxides on the surface of the metal to be welded. Therefore, in the flux used for electronic connection, in order to enhance its solderability, a small amount of halogen compounds are usually added, generally organic acid salts, halogen compounds of amines and alcohols. Halogen-containing fluxes volatilize halogen-containing fumes during soldering, which will cause harm to the body and the environment, and the fumes will generate halogen acids after absorbing water, which will cause electronic product components to fail. If there is residual free halogen in the printed circuit board (PCB) after soldering, it will cause a decrease in surface i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36
Inventor 张鸣玲王永刘竞
Owner 深圳市唯特偶新材料股份有限公司
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