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Water-based cutting fluid used in slice machining of hard brittle crystal material and preparation method of water-based cutting fluid

A technology for crystalline materials and cutting fluids, applied in the directions of additives, petroleum industry, lubricating compositions, etc., can solve the problems of easy adhesion and suspension of chip powder, easy cracking of processed products, low processing efficiency, etc., and achieve easy observation of processing conditions. , avoid machining errors and cracking, good cooling effect

Inactive Publication Date: 2012-08-01
AMER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be commonly used in the slicing process of hard and brittle crystal materials, and has good lubrication, antirust, cleaning, cooling and sedimentation effects, and solves the problem of cutting oil used in the current hard and brittle crystal materials in the process of internal and external slicing. Or the chip powder in the cutting fluid is easy to adhere and suspend, the processing tool wears seriously, the processed product is easy to crack and the precision is not high, the processing efficiency is low, and the post-cleaning is complicated. It protects the machine and improves the processing environment and sanitation. status, reduced costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The cutting fluid used for slicing processing of hard and brittle crystal materials in this embodiment includes the following components by weight: base oil 18, organic amine 17, organic acid 8, synthetic ester 8, emulsifier 13, rust and corrosion inhibitor 8 , dispersing flocculation and anti-hard water agent 1.2, antiseptic bactericide 1.2, defoamer 0.1, coupling agent 5, auxiliary agent 3 and an appropriate amount of water; after adjustment, the pH value of the semi-synthetic water-based cutting fluid in this embodiment is 8; an appropriate amount Water refers to the cutting fluid state suitable for cutting processing obtained by adding water. In this embodiment and the following embodiments, the water is deionized water;

[0030] The preparation method of the water-based cutting fluid for slicing processing of hard and brittle crystal materials in this embodiment comprises the following steps:

[0031] a. Add organic acid and rust and corrosion inhibitor to organic ...

Embodiment 2

[0048] The cutting fluid used for slicing processing of hard and brittle crystal materials in this embodiment includes the following components by weight: base oil 15, organic amine 10, organic acid 5, synthetic ester 5, emulsifier 10, rust and corrosion inhibitor 10 , dispersing flocculation and anti-hard water agent 2, antiseptic bactericide 3, defoamer 1, coupling agent 10, auxiliary agent 5 and an appropriate amount of water; after adjustment, the pH value of the semi-synthetic water-based cutting fluid in this embodiment is 9; an appropriate amount Water refers to the cutting fluid state suitable for cutting processing obtained by adding water, and the water is deionized water;

[0049] The preparation method of the water-based cutting fluid for slicing processing of hard and brittle crystal materials in this embodiment comprises the following steps:

[0050] a. Add organic acid and rust and corrosion inhibitor to organic amine, stir and mix evenly, add water, and stir un...

Embodiment 3

[0067]The cutting fluid used for slicing processing of hard and brittle crystal materials in this embodiment includes the following components by weight: base oil 20, organic amine 20, organic acid 10, synthetic ester 10, emulsifier 15, rust and corrosion inhibitor 5 , dispersing flocculation and anti-hard water agent 0.01, antiseptic bactericide 0.5, defoamer 0.05, coupling agent 2, auxiliary agent 1 and an appropriate amount of water; after adjustment, the pH value of the semi-synthetic water-based cutting fluid in this embodiment is 8.5; an appropriate amount Water refers to the cutting fluid state suitable for cutting processing obtained by adding water, and the water is deionized water;

[0068] The preparation method of the water-based cutting fluid for slicing processing of hard and brittle crystal materials in this embodiment comprises the following steps:

[0069] a. Add organic acid and rust and corrosion inhibitor to organic amine, stir and mix evenly, add water, an...

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PUM

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Abstract

The invention discloses a water-based cutting fluid used in slice machining of a hard brittle crystal material, comprising the following compositions: base oil, organic amine, organic acid, synthetic ester, emulsifier, rust and corrosion inhibitor, dispersion flocculation and hard-water resisting agent, antiseptic bactericide, antifoaming agent, coupling agent, adjuvant and a proper amount of water. Aiming at the machining techniques of inner circle slicing and outer circle slicing, the water-based cutting fluid has good generality, lubricity, strong antirust property and a long service life; when the cutting fluid is used, the machining situation can be observed easily, the cooling property is good, the cleaning and the permeability are strong, cuttings subside easily, and the machining problems of machining error, crack and the like caused by cutter blocking, abrasion and the like are solved; according to the invention, the problems that cuttings are easy to adhere and suspend, a cutter is seriously abraded, a machined product cracks easily, the accuracy is not high, the machining efficiency is low, the later period cleaning is complex and the like existing in the current slice machining of the hard brittle crystal material are solved, and further, a machine bed is protected, and the cost is reduced.

Description

technical field [0001] The invention relates to a lubricating cooling fluid for mechanical processing and a method for using the same, in particular to a water-based cutting fluid for slicing hard and brittle crystal materials and a preparation method thereof. Background technique [0002] Crystal materials such as sapphire, quartz, silicon, germanium, gallium arsenide or gallium nitride have become extremely important substrate materials for modern industries, especially microelectronics and optoelectronics industries; such crystal materials have high hardness and high brittleness. Features, mechanical processing is extremely difficult, and the processing efficiency is low, and the yield is not high. With the development of semiconductor and photovoltaic materials technology, higher requirements are put forward for the specifications and quality of the front-end chips. [0003] At present, only silicon material can be sliced ​​by wire cutting process, and other crystal mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/00C10M161/00C10M141/12C10N30/12C10N30/06C10N30/16C10N30/18
Inventor 张葵涛汪小龙
Owner AMER TECH CO LTD
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