Leadless electronic slurry composition for solar silicon photovoltaic cell and preparation method thereof
A technology of silicon photocells and electronic pastes, which is applied in the manufacture of circuits, electrical components, and final products. It can solve the problems of lead in inorganic glass powder and environmental pollution, and achieve the effects of small bending and improved photoelectric conversion efficiency.
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example 1
[0027] 1. Organic binder
[0028] Ethyl cellulose 2%, resin 1%, cetyl alcohol 2%, diethylene glycol methyl ether 8%, diethylene glycol butyl ether 4%, terpineol 70%, n-butanol 13% by mass percentage composition.
[0029] 2. Inorganic glass powder
[0030] The inorganic glass powder is lead-free glass powder, which is composed of 3% silicon dioxide, 65% boric acid, 3% aluminum oxide, 25% antimony oxide and 4% zirconium oxide by mass percentage.
[0031] 3. Aluminum powder: a spherical aluminum powder with a purity of more than 99.9%, a particle size of 2-3 μm, and a surface protected by a nitrogen layer.
[0032] 4. Additives: 40% of Sipan, 60% of pump oil.
[0033] 5. Preparation of lead-free electronic paste.
[0034] 73% of aluminum powder, 23% of organic binder, 1.5% of inorganic glass powder, and 2.5% of additives are mixed and ground with a three-roll mill to a fineness of 17.5-25 μm and a viscosity of 25,000-30,000 mpa·s to obtain lead-free electronic paste .
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example 2
[0037] 1. Organic binder
[0038] Ethyl cellulose 1%, resin 0.5%, cetyl alcohol 3%, diethylene glycol methyl ether 8.5%, diethylene glycol butyl ether 4%, terpineol 70%, n-butanol 13% by mass percentage composition.
[0039] 2. Inorganic glass powder
[0040] The inorganic glass powder is lead-free glass powder, which is composed of 2% silicon dioxide, 63% boric acid, 4% aluminum oxide, 26% antimony oxide and 5% zirconium oxide by mass percentage.
[0041] 3. Aluminum powder: a spherical aluminum powder with a purity of more than 99.9%, a particle size of 4-5 μm, and a surface protected by a nitrogen layer.
[0042] 4. Additives: 45% of Siban, 55% of pump oil.
[0043] 5. Preparation of lead-free electronic paste
[0044] 75% of aluminum powder, 20% of organic binder, 2% of inorganic glass powder, and 3% of additives are mixed and ground with a three-roll mill to a fineness of 17.5-25 μm and a viscosity of 25,000-30,000 mpa·s to obtain lead-free electronic paste .
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