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Lead-free solder solder paste for electronic industry and method for manufacturing soldering fluid

A technology of lead-free solder and electronics industry, applied in the direction of welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of few types of lead-free solder paste, easy drying, unsatisfactory printing performance, etc., and achieve good The effect of small expansion rate and residual corrosion

Inactive Publication Date: 2008-08-20
TIANJIN QINGHE TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lead-free solder pastes that do not contain lead, mercury, cadmium, chromium 6+, etc. have been used in large quantities. The existing lead-free solder pastes have problems such as few types, easy drying, poor soldering performance, and unsatisfactory printing performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1: a kind of lead-free solder solder paste for electronics industry, is characterized in that: it is made up of the lead-free solder powder of following percentage by weight and flux:

[0038] Lead-free solder powder 89%,

[0039] Flux 11%.

[0040] Said lead-free solder powder is made up of following weight percent raw material:

[0041] The lead-free solder powder used included tin, copper, silver, nickel master alloy, and contained 0.1% titanium, made of 35 micron powder. The main alloy composition is:

[0042] Tin-silver alloy, tin: 96.0%; silver: 4.0%

[0043] Said flux composition is:

[0044] Polymerized Rosin 140# 25%

[0045] Premium Hydrogenated Rosin 30%

[0046] 18 acid amide 2%

[0047] Ethylene bis stearamide 2%

[0048] N,N-Diethylhydroxylamine (DEHA) 1.5%

[0049] Sebacic Acid 2.5%

[0050] Malic acid 4%

[0051] Fluorocarbon Surfactant FSN100 0.2%

[0052] Diethanolamine 0.5%

[0053] Diethylene glycol monoethyl ether balance

...

Embodiment 2

[0065] Embodiment 2: a kind of lead-free solder solder paste for electronics industry, is characterized in that: it is made up of the lead-free solder powder of following percentage by weight and flux:

[0066] 88% lead-free solder powder,

[0067] Flux 12%.

[0068] Said lead-free solder powder is made up of following weight percent raw material:

[0069] The lead-free solder powder used included tin, copper, silver, nickel master alloy, and contained 0.1% titanium, made of 35 micron powder. The main alloy composition is:

[0070] Tin-copper alloy, tin: 99.3%; copper: 0.7%

[0071] Said flux composition is:

[0072] Polymerized Rosin 115# 10%

[0073] Polymerized Rosin 140# 15%

[0074] Premium Hydrogenated Rosin 30%

[0075] 16 acid amide 2%

[0076] 18 acid amide 2%

[0077] N,N-Diethylhydroxylamine (DEHA) 1.5%

[0078] Sebacic acid bis(2,2,6,6-tetramethyl

[0079] -4-Pyridine) ester (light stabilizer 770) 0.5%

[0080] Adipic acid 2.5%

[0081] Sebacic Acid 2.5%...

Embodiment 3

[0096] Embodiment 3: a kind of lead-free solder solder paste for electronics industry, is characterized in that: it is made up of the lead-free solder powder of following percentage by weight and flux:

[0097] 88% lead-free solder powder,

[0098] Flux 12%.

[0099] Said lead-free solder powder is made up of following weight percent raw material:

[0100] The lead-free solder powder used included tin, copper, silver, nickel master alloy, and contained 0.1% titanium, made of 35 micron powder. The main alloy composition is:

[0101] Tin-silver-copper-nickel alloy, tin: 99.1%; silver: 0.3%; copper: 0.5%; nickel 0.1% The flux composition is:

[0102] Polymerized Rosin 115# 10%

[0103] Polymerized Rosin 140# 25%

[0104] Premium Hydrogenated Rosin 20%

[0105] Ethylene bis stearamide 2%

[0106] 18 acid amide 2%

[0107] Nitroxide radical piperidinol (ZJ-701) 1.5%

[0108] Adipic acid 2.5%

[0109] Itaconic acid 4%

[0110] Malic acid 2.5%

[0111] Fluorocarbon Surfac...

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PUM

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Abstract

The invention relates to a welding material, in particular to a preparation method of electronic industry-used lead-free solder paste and flux; wherein, the welding material comprises 85 to 90% lead-free solder powder and 10 to 15% flux; the lead-free solder powder is a 25 to 45 micrometer lead-free solder made by tin, copper, silver and titanium; the flux comprises a high viscosity rosin, an organic acid activator, a thixotropic agent, a wetting agent and a solvent. The welding material has the advantages of green environmental protection of lead-free solder, resolving the drawbacks of lead-free solder of high melting point and low fluidity, high expansion rate, no- halogen, low post-weld residue and corrosive property, high insulation resistance, and good protection performance.

Description

(1) Technical field: [0001] The invention relates to a welding material, in particular to a preparation method of a lead-free solder solder paste and flux for the electronic industry. (two) background technology: [0002] In recent years, as people pay more and more attention to environmental protection, environmental protection laws and regulations are becoming more and more strict. Lead-free solder pastes that do not contain lead, mercury, cadmium, chromium 6+, etc. have been used in large quantities. The existing lead-free solder pastes have problems such as few types, easy drying, poor soldering performance, and unsatisfactory printing performance. The present invention provides a high-reliability lead-free solder paste for the electronics industry with good soldering and printing performance in order to overcome the above-mentioned shortcomings and deficiencies of the prior art. (3) Contents of the invention: [0003] The object of the present invention is to design ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26B23K35/362
Inventor 郭秀兰
Owner TIANJIN QINGHE TECH DEV
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