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Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device

一种半导体、组合物的技术，应用在半导体/固态器件制造、粘合剂类型、半导体器件等方向，能够解决半导体芯片和电路基板粘合力不充分、粘合片材发泡、连接可靠性降低等问题，达到简化安装到电路基板的工序、高速切断、减少溢出量的效果

Active Publication Date: 2008-07-23
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when flip-chip mounting is performed using the adhesive sheet containing polyimide described in Patent Document 7, since the polyimide has high water absorption, heating during mounting causes water to accumulate on the adhesive sheet due to water absorption. Moisture in the sheet evaporates rapidly, resulting in foaming of the adhesive sheet, insufficient adhesion between the semiconductor chip and the circuit board, and reduced connection reliability.

Method used

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  • Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device
  • Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device
  • Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0113] The present invention will be explained by citing the following examples and the like, but the present invention is not limited to the exemplified examples. In addition, the evaluation of the adhesive composition for semiconductors in an Example was performed by the following method.

Synthetic example 1

[0114] Synthesis Example 1 Synthesis of Organic Solvent-soluble Polyimide A

[0115] Under a stream of dry nitrogen, dissolve 24.54g (0.067mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (hereinafter referred to as BAHF) and 1,3-bis(3-amino) in 80g of NMP Propyl) tetramethyldisiloxane (hereinafter referred to as SiDA) 4.97 g (0.02 mol), and blocking agent 3-aminophenol (hereinafter referred to as 3-Aph) 2.18 g (0.02 mol). Then, 31.02g (0.1mol) of bis(3,4-dicarboxyphenyl)ether dianhydride (hereinafter referred to as ODPA) and 20g of NMP were added to it, reacted at 20°C for 1 hour, and then stirred at 50°C 4 hours. Then, 15 g of xylene was added to azeotrope water and xylene while stirring at 180°C for 5 hours. After the stirring, the solution was poured into 3L of water to obtain a white precipitated polymer. The precipitate was filtered, recovered, washed with water three times, and dried at 80°C for 20 hours with a vacuum dryer. The obtained polymer solid was measured ...

Synthetic example 2

[0116] Synthesis Example 2 Synthesis of Organic Solvent-soluble Polyimide B

[0117] Under a stream of dry nitrogen, 18.31 g (0.05 mol) of BAHF, 7.46 g (0.03 mol) of SiDA, and 4.37 g (0.04 mol) of 3-Aph were dissolved in 150 g of NMP. Add 52 g (0.1 mol) of 2,2-bis(4-dicarboxyphenoxy) phenyl) propane dianhydride (hereinafter referred to as BSAA) and 30 g of NMP, and react at 20°C for 1 hour, and then Stir at 50°C for 4 hours. Next, it was stirred at 180°C for 5 hours. After the stirring, the solution was poured into 3L of water to obtain a white precipitated polymer. The precipitate was filtered, recovered, washed with water three times, and dried at 80°C for 20 hours with a vacuum dryer. The obtained polymer solid was measured by infrared absorption spectroscopy, at 1780cm -1 Nearby, 1377cm -1 An absorption peak derived from the imide structure of polyimide was detected nearby. In this way, an organic solvent-soluble polyimide B having a functional group capable of reacting with a...

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Abstract

The present invention provides an adhesive composition for a semiconductor that does not break or peel off even when it is bent during handling, and that can be laminated with a narrow pitch and a high number of pins. The bump electrode is laminated on the electrode side of the semiconductor wafer, and high-speed dicing can be performed without contamination or defects of cutting powder during dicing, and alignment marks can be easily recognized during dicing and flip-chip mounting. An adhesive composition for semiconductors containing (a) an organic solvent-soluble polyimide, (b) an epoxy compound, and (c) a curing accelerator, wherein, relative to 100 parts by weight of the (b) epoxy compound, Containing 15 to 90 parts by weight of (a) organic solvent-soluble polyimide, 0.1 to 10 parts by weight of (c) curing accelerator, and (b) epoxy compound containing a compound that is liquid at 25°C and 1.013×105N / m2 For compounds that are solid at 25°C and 1.013×105N / m2, the proportion of liquid compounds in all epoxy compounds is 20% by weight or more and 60% by weight or less.

Description

Technical field [0001] The present invention relates to an adhesive composition for a semiconductor, a semiconductor device using the composition, and a method for manufacturing a semiconductor device. The adhesive composition for a semiconductor is used as follows: an adhesive composition for a semiconductor is formed on a semiconductor wafer After the composition, the wafer with the adhesive composition for semiconductors is made into individual semiconductor chips such as ICs and LSIs by dicing, and the semiconductor chips are directly electrically connected to flexible substrates, glass epoxy substrates, and glass substrates. , Ceramic substrates and other circuit boards. Background technique [0002] In recent years, with the miniaturization and high density of semiconductor devices, as a method of mounting semiconductor chips on a circuit board, a flip-chip mounting (direct chip attach mounting) method has attracted attention and is rapidly being promoted. In flip-chip moun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B32B27/00C08L63/00C08L79/08C09J7/02C09J179/08H01L21/52
CPCC08L63/00C08L79/08C08L2666/20C08L2666/22C09J163/00C09J179/08H01L21/563H01L23/544H01L24/29H01L24/81H01L24/83H01L2223/5442H01L2223/54426H01L2223/54453H01L2223/54473H01L2223/5448H01L2224/2919H01L2224/2929H01L2224/29298H01L2224/293H01L2224/73203H01L2224/81121H01L2224/81801H01L2224/8385H01L2924/00011H01L2924/00013H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01009H01L2924/01013H01L2924/01015H01L2924/01019H01L2924/01023H01L2924/01024H01L2924/01027H01L2924/01033H01L2924/01046H01L2924/0105H01L2924/01077H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/0665H01L2924/07802H01L2924/09701H01L2924/12044H01L2924/14H01L2924/15787H01L2924/15788H01L2924/19042Y10T428/287Y10T428/31515H01L2924/07025H01L2924/00H01L2924/00014H01L2924/3512H01L2224/29099H01L2224/29199H01L2224/29299C09J11/06
Inventor 藤丸浩一野中敏央
Owner TORAY IND INC
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