Method for preparing ultra-fine/nano tungsten-copper-nickel composite powder

Abstract

Provided is a process for preparing an ultra-fine / nanometer W-Cu-Ni composite powder. Firstly according to the proportion of W-Cu-Ni ingredients, relative metal salt is prepared to mixed salt solution with a concentration of 10-30wt% percents, a small amount of acids are added to control the pH, and surfactant gels are added to control particles in solution to reunite, thereby obtaining a mixed salt sol colloid of a homogeneous system. The mixed salt sol colloid is sprayed, dried, burned, and two-stage or multi-stage reduction is applied between 150 and 900 DEG C and under H2 atmosphere, and the ultra-fine / nanometer W-Cu-Ni composite powder is obtained. By adopting the ultra-fine / nanometer W-Cu-Ni composite powder prepared by the invention, the proportion of ingredients can be adjusted, and the proportion of ingredients of each element in powder is capable of being adjusted according to the requirement of alloys property. The powder has good coking characteristic, the density of alloys is high, and the characteristic that inhomogeneous organization when the content of CU is high in W-Cu alloys system is overcome.

Description

Technical field: [0001] The invention relates to an ultrafine / nano-scale W-Cu-Ni composite powder with adjustable composition ratio prepared by nanotechnology, which belongs to the field of nano-powder materials and powder metallurgy. Background technique: [0002] W-Cu composite materials are widely used in the electrical industry, electronic information and military industries, such as medium and high voltage electrical contact materials, electronic packaging, heat sink materials, etc., and are a very versatile material. However, because W and Cu are incompatible with each other, the wettability of Cu to W is very poor, and the melting points of W and Cu are very different. Difficult to meet requirements. Traditional W-Cu composite materials generally adopt high temperature liquid phase sintering and Cu infiltration sintering, both of which have great disadvantages. [0003] Chinese patent 03143145.3 discloses a preparation method of a fine-grained tungsten-copper compos...

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Problems solved by technology

[0004] However, when the Cu phase composition in the powder is high (more than 40%), the segregation of Cu is easy to occur by the above method, which makes the sintering process of controlling the uniform structure and dense alloy more difficult, which is unfavorable for improving and stabilizing the performance of the alloy