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Welding resistant agent composition for flexible substrate, flexible substrate and preparation method for the flexible substrate

A flexible substrate and solder resist technology, applied in the field of solder resist ink, can solve problems such as poor electrical characteristics and brittle coating film

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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the solder heat resistance test etc. is repeated, it will be completely cured and the coating film will become brittle
In addition, since an acid catalyst is used as a curing catalyst, there is also a problem of poor electrical characteristics, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0054] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples. In addition, unless otherwise specified below, "part" means a weight part.

[0055] The patterns of the thermosetting compositions of Examples and Comparative Examples were printed on an FR-4 substrate on which a circuit was formed by screen printing, and the dried coating film was about 30 μm, and cured at 170° C. for 60 minutes.

[0056] evaluate

[0057] (1) Solvent resistance

[0058] The obtained substrate was immersed in propylene glycol monomethyl ether acetate for 30 minutes, dried, and then subjected to a peeling test using a cellophane tape to evaluate peeling and discoloration of the coating film.

[0059] ○: No peeling or discoloration

[0060] ×: There is peeling or discoloration

[0061] (2) Heat resistance

[0062] Apply rosin-based flux to substrates obtained in the same manner as for solvent resistance us...

Synthetic example 1

[0073] 214.3 parts of carbitol acetate and 24.0 parts of azobisisobutyronitrile were added to a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, and heated to 70° C. under a nitrogen atmosphere. A mixed monomer of 18.0 parts of acrylic acid, 162.5 parts of isobutyl methacrylate, and 319.5 parts of 2-ethylhexyl methacrylate was added dropwise thereto over 3 hours. Thereafter, it was further stirred and reacted for 4 hours to obtain a polycarboxylic acid resin solution in which the non-volatile content was 70%, the solid content acid value was 28.1 mgKOH / g, the weight average molecular weight was 16000, and the calculated value of Tg obtained from the FOX formula = 9.7°C. Hereinafter, this polycarboxylic acid resin solution is called A varnish.

[0074] The components and evaluation results of each composition are summarized in Table 1 below.

[0075] Example

comparative example

1

2

3

4

5...

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PUM

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Abstract

The invention provides a solder resist combination of flexible basal plate with excellent flexibility (softness) and thermal resistance, also provides a solder resist combination of flexible basal plate. Even though crosslinking is performed through adequate curing reaction without residung not-curing part, the solder resist combination is reinforced, soft, and with excellent thermal resistance, furthermore, even though the fill rate of fill is increased to improve therma conductivity, it is not easy to rupture and the softness can be kept. The said solder resist combination of flexible basal plate contains (A)hydrogenated biphenyl epoxy resin, (B) rubber shape compound with functional group reacting with epoxy group, or (C) alumina grain.

Description

technical field [0001] The present invention relates to a solder resist ink used in flexible substrates requiring soft flexibility, for example, a solder resist ink used as a solder resist ink for the manufacture of printed circuit boards of small electronic devices such as mobile notebook computers and mobile phones. Solder resist composition for flexible substrates. Background technique [0002] As solder resists used in the manufacture of flexible printed wiring boards and tape carrier packaging (Tape Carrier Packaging), there are the following types: Polyimide called a coverlay film is punched out with a mold corresponding to the pattern. The type that is pasted with an amine film and then attached with an adhesive; the type that uses screen printing to form a flexible film with UV-curable, heat-curable solder resist ink or liquid polyimide ink; Flexible film-coated liquid photo-solder resist ink type. [0003] There was a problem that the cover film had no followabili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D5/25H05K1/03
CPCG03F7/004G03F7/0042G03F7/0045G03F7/0047
Inventor 大胡义和宇敷滋
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