Heat conduction mechanism of high and low temperature circulating device with wide temperature range

A high and low temperature cycle, wide temperature technology, used in lighting and heating equipment, coolers, refrigerators and other directions, can solve problems such as point contact, increased thermal resistance, heat transfer table rise, and cooling rate decline.

Inactive Publication Date: 2008-07-09
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Application Information

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Problems solved by technology

In this way, even if the heat transfer table presses the bottom of the liquid nitrogen sub-cylinder or the upper surface of the heating table, due to the unevenness of the actual processing surface or the downward protrusion of the bottom of the sub-cylinder, the actual contact area of ​​the heat transfer surface will be very small, even It may become a point contact, which will inevitably lead to a sharp increase in thermal resistance, so that the heating and cooling rate of the heat transfer table will drop sharply

Method used

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  • Heat conduction mechanism of high and low temperature circulating device with wide temperature range
  • Heat conduction mechanism of high and low temperature circulating device with wide temperature range

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Embodiment Construction

[0011] Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail:

[0012] The heat conduction mechanism of the present invention includes: a low temperature heat conduction mechanism and a high temperature heat conduction machine.

[0013] The low-temperature heat conduction mechanism is placed outside the bottom of the liquid nitrogen sub-cylinder, and consists of ring-shaped indium sheets 2 coated with heat-conducting silicone grease layers 1 on both sides, transition cold heads 3 and circular indium sheets 4 arranged in sequence from top to bottom. The ring-shaped indium sheet 2 and the transition cold head 3 are fixed on the bottom of the liquid nitrogen sub-cylinder 6 by screws 5, and the circular indium sheet 4 is pasted on the bottom surface of the transition cold head 3 through a heat-conducting silicone grease layer 7. The ring-shaped indium sheet 2 requires the upper and lower sides to be processed flat, ...

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Abstract

The disclosed heat conduction mechanism in high-low temperature cycle unit with wide temperature range is used to reliability testing for semiconductor device and environmental stress screening for China patent 200410067891.9, which comprises: a low-temperature heat conduction mechanism in the outer bottom of liquid nitrogen sub-cylinder and contained a ring indium plate with heat-conducting silicon resin layer on both surfaces, a transient cooling head and a circular indium plate; and a high-temperature heat conduction mechanism on the heating station and formed by sticking heat-conducting silicon resin layers on the station. This invention improves the speed for testing and screening.

Description

technical field [0001] The invention relates to a high-low temperature cycle equipment with a wide temperature range in the reliability test and environmental stress screening equipment of semiconductor devices, and specifically refers to the heat conduction mechanism in the equipment. Background technique [0002] Chinese patent 200410067891.9 discloses a high and low temperature cycle device with a wide temperature range, which is a temperature cycle device from low temperature ≤ -173°C to room temperature, and is mainly used for environmental stress screening of infrared detectors on artificial satellites. The device is mainly composed of a master system, a slave system and a PC. The main system is mainly responsible for realizing the temperature cycle function and control, and the slave system automatically replenishes the consumed liquid nitrogen in the cold environment of the main system. The main system consists of a vacuum container, a liquid nitrogen sub-cylinder t...

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Application Information

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IPC IPC(8): G01R31/26H01L21/66G01M19/00F25B9/14G01M99/00
CPCF25D19/006
Inventor 吴礼刚朱三根龚海梅李向阳方家熊董德平
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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