A
cutting instrument including a
metal blade has a recess formed therein and a
semiconductor substrate affixed to the blade in the recess. The
semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the
semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The
cutting instrument may also further include a
handle wherein the blade is affixed to the
handle and the semiconductor substrate is electrically coupled to the
handle. The handle may then be coupled, either physically or by
wireless transmission, to a computer that is adapted to display information to a person using the
cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor
wafer and a layer of
photoresist being applied on a top side of the semiconductor
wafer according to a pattern that matches the defined shape of the semiconductor substrate. The portion of the semiconductor
wafer not covered by the
photoresist is removed and thereafter the
photoresist is removed from the semiconductor wafer, thereby leaving the semiconductor substrate having a defined shape and at least one sensor formed thereon. The semiconductor substrate having a defined shape and at least one sensor formed thereon is then affixed to a
metal blade in a recess formed in said blade.