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Novel polyimide film

A technology of polyimide film and molecular orientation, which is applied to other household appliances, synthetic resin layered products, chemical instruments and methods, etc., to achieve the effect of inhibiting dimensional change, reducing the amount of change, and reducing the rate of dimensional change

Active Publication Date: 2007-06-06
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in any of the above-mentioned documents, the ratio of the hygroscopic expansion coefficient (a) in the direction parallel to the molecular orientation axis and the hygroscopic expansion coefficient (b) in the direction perpendicular to the molecular orientation axis, which is a characteristic part of the present invention, is specified Polyimide membranes within the scope, without any disclosure and therefore completely different from the present invention

Method used

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  • Novel polyimide film
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  • Novel polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0165] (Manufacture of polyimide film)

[0166] In this example, in N,N-dimethylformamide (DMF), with 45 mole % of 4,4-diaminodiphenyl ether (ODA), 55 mole % of p-phenylenediamine (p- PDA), 45 mol% of p-phenylene bis(trimellitic acid monoester anhydride) (TMHQ), and 55 mol% of pyromellitic dianhydride (PMDA) are added and polymerized to synthesize polyamic acid solution. In this polyamic acid solution, add 2.0 times the equivalent of acetic anhydride and 1.0 times the equivalent of isoquinoline relative to the equivalent of the amic acid, cast it on an endless belt with a width of 1100mm, and dry it with hot air at 100°C to 150°C for 2 Minutes, so that the final thickness is 20 μm, thereby obtaining a self-supporting gel film with a residual component ratio of 54% by weight. Then, the gel film was peeled off from the tape, and both ends in the width direction of the gel film were fixed on a continuously conveyed pin board. At this time, fixation without slack was performed ...

Embodiment 2

[0187] A polyimide film was produced by the same manufacturing method as in Example 1, except that the needle pitch was 1020 mm, the TD shrinkage ratio was 4.30, and the TD expansion ratio was 4.30 when it was fixed on a needle plate. The production conditions are shown in Table 1.

[0188] The physical property values ​​of the polyimide film thus obtained were evaluated in the same manner as in Example 1. As a result, it can be confirmed that the polyimide film obtained is that the hygroscopic expansion coefficient ratio b / a over the entire width of the film is controlled to be 1.01 to 2.00, and the difference between the maximum value and the minimum value of the hygroscopic expansion coefficient ratio is controlled. It is controlled to be less than 0.30, and the molecular orientation angle is controlled to be less than 0±20°. Table 2 shows the physical property values ​​of the obtained film.

Embodiment 3

[0190] In addition to making the remaining component ratio 60% by weight when manufacturing the gel film, when fixing it on the needle plate, it is fixed so that the needle pitch is 1060mm, the TD shrinkage ratio is 3.70, the TD expansion ratio is 0.00, and the temperature in the firing furnace is Except for 132 degreeC, 255, 350, 440, and 512 degreeC, the polyimide film was produced by the manufacturing method similar to Example 1. The production conditions are shown in Table 1.

[0191] The physical property values ​​of the polyimide film thus obtained were evaluated in the same manner as in Example 1. As a result, it can be confirmed that the polyimide film obtained is that the hygroscopic expansion coefficient ratio b / a over the entire width of the film is controlled to be 1.01 to 2.00, and the difference between the maximum value and the minimum value of the hygroscopic expansion coefficient ratio is controlled. It is controlled to be less than 0.30, and the molecular or...

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Abstract

A polyimide film that can provide a flexible metal-clad laminate plate which causes no significant dimensional change upon etching of the metal layer. The polyamide film is characterized in that, in the whole width of a continuously produced polyimide film, the ratio of the hygroscopic swelling coefficient in a direction (b) perpendicular to the molecular orientation axis to the hygroscopic swelling coefficient in a direction (a) parallel to the molecular orientation axis, i.e., b / a, is not less than 1.01 to not more than 2.00 and the difference between the maximum value of the hygroscopic swelling coefficient ratio and the minimum value of the hygroscopic swelling coefficient ratio is not more than 0.30.

Description

technical field [0001] The present invention relates to a polyimide film having a ratio of a hygroscopic expansion coefficient (a) in a direction parallel to a molecular orientation axis to a hygroscopic expansion coefficient (b) in a direction perpendicular to the molecular orientation axis across the entire width within a specific range. In more detail, it relates to a polyimide film that can be suitably used for electrical and electronic equipment substrate applications such as flexible printed wiring boards, TAB tapes, and solar cell substrates, or for high-density recording. media, magnetic recording media, and can suppress the dimensional change rate in the process of manufacturing flexible printed circuit boards, such as the process of forming a metal layer, especially the process of laminating metal foil while heating, or the process of etching a metal layer , and can stabilize physical property values ​​(dimensional change rate) over the full width of the film. Back...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B32B27/34C08L79/08
CPCB32B27/34H05K1/0393B32B2457/08C08J5/18C08J2379/08B32B15/08H05K1/0346H05K2203/1545B32B2307/734B32B2429/02H05K2201/0154B32B27/281C08G73/10C08L79/08
Inventor 藤原宽小野和宏松胁崇晃
Owner KANEKA CORP
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