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Single slice integration temperature, humidity, pressure sensor chip based on polymer material

A technology of polymer materials and sensor chips, applied in thermometers, thermometers using electric/magnetic elements that are directly sensitive to heat, material capacitance, etc., can solve problems such as difficult to achieve and poor compatibility

Inactive Publication Date: 2006-10-11
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to make a miniature integrated sensor, the widely used methods such as moisture absorption method, specific gravity method and optical method in traditional measurement are poorly compatible with MEMS technology and difficult to realize. Therefore, these methods generally need to be coated on the transducer. Wrapping moisture-sensitive materials

Method used

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  • Single slice integration temperature, humidity, pressure sensor chip based on polymer material
  • Single slice integration temperature, humidity, pressure sensor chip based on polymer material
  • Single slice integration temperature, humidity, pressure sensor chip based on polymer material

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Embodiment Construction

[0021] specific implementation plan

[0022] The invention adopts MEMS technology to manufacture a miniature platinum resistor on a silicon chip, which is used for temperature measurement and can also be used for heating the moisture-sensitive polymer to quickly volatilize water.

[0023] The invention utilizes the principle of the capacitance method to design the humidity sensor, and can measure the relative humidity.

[0024] The invention utilizes the principle of the strain resistance method to design the pressure sensor, and can measure the absolute pressure after vacuum packaging.

[0025] A chip of a monolithic integrated temperature, humidity and pressure sensor of the present invention utilizes microelectronics manufacturing technology to produce resistors and flat electrodes on a substrate (silicon or other materials), and two resistors are connected in series to form an electric bridge One arm of the resistor is part of the pressure measurement; the other resistor ...

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Abstract

The single integrated sensor chip for temperature, humidity and pressure is manufactured by: on substrate, processing a parallel plate as the electrode of a capacitor for humidity and three resistances as the strain resistance and thermistor; preparing one layer of polymer on the plate and resistances as the capacitor dielectric medium and the elastic membrane respectively; arranging a grid plate on former dielectric medium as another capacitor electrode; forming a voltage-measuring bridge by resistances on pressure-sensitive membrane and substrate; vacuum sealing the cavity under the pressure-sensitive film to measure absolute pressure.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a sensor, in particular to a structure and a manufacturing method of a multi-sensor monolithic integrated chip for measuring ambient temperature, humidity and pressure. Background technique [0002] Micro-integrated multi-sensor is one of the important directions in the research and development of sensor technology. Temperature, humidity and pressure are important physical quantities involved in biomedicine, environment and industrial and agricultural production. Usually, separate sensors are used for the measurement of these physical quantities; thermistor or platinum resistance is used for temperature; capacitance method, moisture absorption method, specific gravity method, optical method, etc. are widely used for humidity measurement; silicon Pressure sensor, etc. Separate sensors are characterized by large volume and high power consumption, which cannot meet the requirements of sm...

Claims

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Application Information

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IPC IPC(8): H01L27/01B81B7/00G01K7/18G01K7/22G01L1/22G01N27/22
Inventor 赵湛王奇曾欢欢方震张博军
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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