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Electrolytic copper foil coating excellent in chemical resistance and cohesive force and its surface treatment method

A chemical resistance, electrolytic copper foil technology, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of unsatisfactory acid resistance deterioration rate of surface-treated copper foil, inconvenient operation, etc. Conducive to the effect of cleaner production

Inactive Publication Date: 2006-10-11
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The object of the present invention is to provide a kind of electrolytic copper foil coating and its surface treatment method with good chemical resistance and cohesive force, the method electrolytic Zn-Ni-Sn ternary metal alloy layer on the surface of electrolytic copper foil, and then through Chromate passivation treatment and coating a layer of silane coupling agent not only solves the problem of inconvenient operation caused by the step-by-step electroplating method in the existing copper foil surface treatment process, but also solves the problem of the existing surface treatment copper foil Current status of unsatisfactory acid deterioration rate

Method used

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  • Electrolytic copper foil coating excellent in chemical resistance and cohesive force and its surface treatment method
  • Electrolytic copper foil coating excellent in chemical resistance and cohesive force and its surface treatment method
  • Electrolytic copper foil coating excellent in chemical resistance and cohesive force and its surface treatment method

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specific Embodiment approach 1

[0014] Embodiment 1: In the electrolytic copper foil coating in this embodiment, the mass percentage of Zn is 65-75%, the mass percentage of Ni is 20-30%, and the mass percentage of Sn is 3-7% %.

specific Embodiment approach 2

[0015] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the mass percentage of Zn in the electrolytic copper foil coating is 75%, the mass percentage of Ni is 22%, and the mass percentage of Sn is 3% %.

specific Embodiment approach 3

[0016] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the mass percentage of Zn in the electrolytic copper foil coating is 70%, the mass percentage of Ni is 25%, and the mass percentage of Sn is 5% %.

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Abstract

This invention relates to the electrolytic copper foil coat with well chemically-resistant and combining power and its surface processing method. In the electrolytic copper foil coat, Zn takes up 65-75%, Ni takes up 20-30%, Sn takes up 3-7%. The processing method as follows: 1 preparing galvanic solution; 2 choosing adding substance; 3 preprocessing electrolytic copper foil; 4 electric depositing. The FR4 covered with copper foil pressing board pressed by the produced copper foil can obtain more than 1.9-2.0N / mm striping intensify and less than 2% acid resistance degradation rate.

Description

technical field [0001] The invention relates to a ternary alloy coating and a treatment method thereof. Background technique [0002] Electrolytic copper foil is an important material for making printed circuit boards (PCB). PCB is mainly used in electronic computers, industrial control, aerospace and all consumer appliances and other fields. With the rapid development of the electronic information industry, my country's demand for printed circuit boards is also increasing, which brings a good market prospect and development opportunities for the electrolytic copper foil industry. As an important copper processing product, the importance of copper foil in the modernization of industry and national defense is becoming more and more obvious. It can be said that the level of copper foil production technology reflects the level of a country's industrial products to some extent. [0003] Electrolytic copper foil is processed into printed circuit boards through circuit etching. ...

Claims

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Application Information

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IPC IPC(8): C25D3/56H05K1/09B32B15/01
Inventor 安茂忠王征徐树民胡旭日
Owner HARBIN INST OF TECH
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