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Low-flowability acrylic ester for multilayer flexible printed circuit

A technology of acrylate glue and flexible printed circuit, which is applied in the direction of printed circuit parts, lamination, layered products, etc., and can solve problems such as overflow and clogged micropores

Inactive Publication Date: 2006-09-27
湖北省化学研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, the polymer synthetic resin glue used in the above patents can also meet the requirements of M-FPCB. Many pads and via holes need to be reserved. The polymer synthetic resin adhesive has a certain fluidity before curing at high temperature. If the fluidity of the adhesive is too large, it will overflow from the pads and via holes after being pressed and block the micro. hole
However, if the fluidity of the adhesive is too small, the fusion between the layers is insufficient, resulting in "false" bonding; at the same time, the steps formed by the copper lines and the substrate formed after etching also need to be filled with flowing resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Get 4 grams of methacrylic acid, 6 grams of glycidyl methacrylate, 84 grams of butyl acrylate, 25 grams of methyl methacrylate, 12 grams of acrylonitrile, 0.75 grams of 2-(tert-butylazo) isobutyronitrile, Toluene: ethyl acetate = 2:1 mixed solvent 265 grams of mixed liquid, in a 500 ml three-necked bottle equipped with a stirrer, condenser, thermometer, heated to reflux for 10 hours to obtain multi-component copolymerized acrylate glue group A share. Taking this as the base material, another 18g of polyurethane rubber NG-320 was taken and melted into 65 grams of mixed solvent of toluene:ethyl acetate=2:1 to obtain component B, which was compounded with the above-mentioned component A to obtain the compound of the present invention. Low flow modified acrylate adhesives for multilayer flexible printed circuits described above.

[0050] Test sample preparation method:

[0051] 1. Apply the selected adhesive evenly on the polyimide film with a thickness of 0.025mm, pre-ba...

Embodiment 2

[0057] Get 15 grams of acrylic acid, 18 grams of β-hydroxyethyl acrylate, 380 grams of butyl methacrylate, 22 grams of styrene, 68 grams of methyl methacrylate, 6.4 grams of benzoyl peroxide, xylene: acetone: butyl acetate Esters = 1500 grams of mixed solvent of 2:1:1, heated and refluxed for 16 hours in a 10-liter reaction bottle equipped with a stirrer, condenser, and thermometer, cooled and filtered the material to obtain component A of multi-component copolymerized acrylate glue . Using this as the base material, another 100g polyurethane rubber J 2 h-85, after 30 minutes of masticating in a two-roller rubber mixer, then dissolved in 350 g of mixed organic solvents of xylene: acetone: butyl acetate = 2: 1: 1 as component B and component A The low-fluidity modified acrylate adhesive for the multilayer flexible printed circuit of the present invention is obtained.

[0058] Operate by the same sample preparation method as in Example 1:

[0059] 1. Spread this adhesive even...

Embodiment 3

[0063] Take 10 grams of methacrylamide, 10 grams of β-hydroxypropyl acrylate, 150 grams of 2-ethylhexyl acrylate, 10 grams of vinyl acetate, 25 grams of acrylonitrile, 0.50 grams of dilauroyl peroxide, and 400 grams of toluene The mixed liquid formed was heated to reflux for 18 hours in a 1000 ml reaction bottle equipped with a stirrer, a condenser and a thermometer, cooled and filtered to obtain component A of multi-component copolymerized acrylate glue. Take this as the base material, take another 120 grams of polyurethane rubber SA-1G, masticate it on the open mill for 60 minutes, and dissolve it in 400 grams of toluene solvent as the B component, and compound it with the A component to obtain the compound of the present invention. Low flow modified acrylate adhesives for multilayer flexible printed circuits described above.

[0064] Operate by the same sample preparation method as in Example 1:

[0065] 1. The adhesive is evenly coated on the polyimide film with a thickne...

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PUM

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Abstract

The invention discloses a low-liquidity acrylate adhesive on multiple flexible printing circuits, whose superior information: 2005100189758 CN 2005-6-23. The adhesive is composed of polybasic acrylate monomer, crosslinking modified monomer, organic solvent, reaction initiator and special polyester rubber macromolecular modifier. The preparing method of acrylate adhesive comprises the following steps: selecting polybasic acrylate monomer; crosslinking monomer; putting the monomers, organic solvent and initiator in the reactor at certain proportion; stirring the reaction to polymerize; blending the macromolecular compound and acrylate adhesive to constitute a new gel type with half-interpirecing network structure.

Description

technical field [0001] The invention relates to the formulation and preparation of adhesives in the field of fine chemicals, in particular to a thermosetting polymer synthetic resin adhesive used for bonding between layers of multi-layer flexible printed circuit boards in the electronic industry printed circuit board industry and preparation. Background technique [0002] Printed circuit board (PCB) is the carrier of electronic components and the most important and basic part of electronic equipment. Flexible printed circuit (printed C) adapts to the needs of electronic equipment in the direction of miniaturization and multi-function. Therefore, in recent years, FPC technology has been widely used in computer, communication, aerospace, automobile, medical equipment, military and consumer electronics industries. be applied more and more widely. The multi-layer flexible printed circuit (M-FPC) has a higher degree of integration and is a product with a higher technical conten...

Claims

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Application Information

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IPC IPC(8): C09J133/08H05K1/02B32B37/12C09J175/06
Inventor 范和平杨蓓
Owner 湖北省化学研究院
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