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Antistatic packaging material

A packaging material and anti-static technology, applied in polyurea/polyurethane coatings, devices for coating liquids on surfaces, and other chemical processes, etc., can solve the problems of high cost, complicated production, etc. Inexpensive effect

Inactive Publication Date: 2006-07-26
黄晖
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the multi-layer packaging material can prevent and remove static electricity well, the packaging material is complicated to make and the cost is very high

Method used

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Embodiment 1

[0032]A conductive polymer packaging material, comprising a substrate and at least one conductive polymer layer coated on the substrate, characterized in that the conductive polymer layer is composed of the following materials in weight percentage:

[0033] Carbon powder 5%, polyurethane 40%, dispersant 5%, coupling agent 4%, thinner 20%, thickener 1%, solvent 25%;

[0034] The substrate of the present invention is PS polystyrene, the polyurethane is polyacrylate, the dispersant is PVP polyvinylpyrrolidone, and the coupling agent is long-chain alkyltrimethoxysilane. The diluent is epoxy resin diluent, the thickener is associative polyurethane thickener, and the solvent is deionized water.

[0035] First, after adjusting the conductive polymer formula, the substrate is heated to the required temperature below the melting point, and then the mixed conductive polymer is coated on the surface of the substrate through the coating equipment, such as figure 1 As shown, one layer of ...

Embodiment 2

[0037] A conductive polymer packaging material, comprising a substrate and at least one conductive polymer layer coated on the substrate, characterized in that the conductive polymer layer is composed of the following materials in weight percentage:

[0038] Carbon powder 0.5%, polyurethane 60%, dispersant 2%, coupling agent 0.5%, thinner 18%, thickener 2.5%, solvent 16.5%.

[0039] Among them, the base material is PE polyethylene, the polyurethane is polypropylene, the dispersant is RSH alkyl mercaptan, the coupling agent is long-chain alkyl trimethoxysilane, and the diluent The epoxy resin diluent is selected as the solvent, the polycarboxylic acid thickener is used as the thickener, and distilled water is selected as the solvent.

Embodiment 3

[0041] A conductive polymer packaging material, comprising a substrate and at least one conductive polymer layer coated on the substrate, characterized in that the formula of the conductive polymer layer is as follows:

[0042] Carbon powder 2%, polyurethane 55%, dispersant 3%, coupling agent 2%, thinner 18%, thickener 0.6%, solvent 17.4%, anti-blocking agent 2%.

[0043] Wherein the base material is selected from PET polyethylene terephthalate, the described polyurethane is selected from isocyanate, the dispersant is selected from PVP polyvinylpyrrolidone, and the described coupling agent is selected from long-chain alkyl trimethoxysilane. The diluent mentioned above is epoxy resin thinner, the thickener is a cross-linked polymer emulsion formed by copolymerization of ethyl acrylate and methacrylic acid, the anti-blocking agent is talc, and the solvent is deionized water.

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Abstract

Disclosed is an antistatic packing material, characterized in that the surface of the package base material is coated or fused by a layer of conductive polymer comprising the following materials (by weight percent): carbon powder 0.5-10%, polyamine ester 40-60%, addition agent 15-50%, solvent 15-40%, the addition agent comprises dispersing agent 2-15%, coupling agent 0.5-10%, thinning agent 12.5-35%.

Description

technical field [0001] The invention relates to a packaging material, in particular to an antistatic packaging material. Background technique [0002] Packaging materials are widely used in people's life and work, but different industries have different requirements for packaging materials. At present, the electronics industry is developing very rapidly, and many components or components are being gradually standardized, which involves packaging and transportation issues. These devices are very sensitive to static electricity, such as optical drive heads, integrated circuit module liquid crystals or other Components, etc., whether they are manufactured or transported, must be completed under dust-free or static-free conditions. Ordinary plastic films or sheets cannot meet the demand because they do not have electrical conductivity. How to endow plastic film or sheet packaging with conductive properties? Most of the current treatment methods use surface treatment methods, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/16C09D175/04B05D7/02
Inventor 黄晖
Owner 黄晖
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