Wire cutting liquid of semiconductor material

Abstract

A linear cutting liquid for semiconductor material is prepared from polyethanediol 10-10000, amine soda, penetrant, ether-alcohol as activating agent, chelating agent and deionized water. Its advantages are less corrosion to cutting wire, no filings deposit on the surface of Si chip, high penetrating, lubricating and cooling effect and low cost.

Description

technical field [0001] The invention belongs to cutting fluid, in particular to a wire cutting fluid for semiconductor materials. Background technique [0002] During the ingot slicing process, due to the strong mechanical force, the edge of the silicon wafer is prone to microcracks, chipping and stress concentration points, and the surface of the silicon wafer also has uneven stress distribution and damage. These defects are the cause of a large number of IC manufacturing. Slip lines, epitaxial stacking faults, slip dislocations, micro-defects and other secondary defects are important factors for the cracking of silicon wafers and chips. [0003] In recent years, the silicon single crystal substrate wire cutting process, which has been developing strongly in recent years, has shown its huge advantages compared with the inner diameter cutting process in many aspects such as the depth of damage on the surface of the silicon wafer, the consistency of the surface structure, and...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the technical problem that the known wire cutting fluid has unsatisfactory effects in overcoming the surface damage, mechanical stress and thermal stress of the silicon wafer in the wire cutting process, and discloses a chemically effective, easy to clean, good heat dissipation effect, It has good penetration and lubricating effect, can significantly reduce the depth and stress of the damaged layer on the surface of silicon wafers, and is a cheap wire cutting fluid for semiconductor materials