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Flexible bendable metal pattern based on laser technology and preparation method and application thereof

A technology of metal patterns and laser technology, which is applied in metal material coating process, printed circuit manufacturing, circuit substrate materials, etc., can solve the problems of loss of conductivity, damage to polymer matrix, easy fracture of copper layer, etc., and achieve low cost, Simple operation and good production flexibility

Pending Publication Date: 2022-07-22
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the metal circuit prepared by this process loses conductivity when it is bent because the rigid copper layer is easily broken.
And the addition of laser sensitizer will destroy the original properties of the polymer matrix such as mechanical properties, transparency, etc.

Method used

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  • Flexible bendable metal pattern based on laser technology and preparation method and application thereof
  • Flexible bendable metal pattern based on laser technology and preparation method and application thereof
  • Flexible bendable metal pattern based on laser technology and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Example 1. Preparation of Flexible Bendable Metal Patterns

[0046] The laser sensitizer suspension was obtained by stirring and mixing 2wt.% zinc-barium white and 98wt.% deionized water. The suspension was scraped on the porous PA film with a pore size of 0.05 μm using a scraper, and the solvent was removed by drying. The surface of the PA film coated with laser sensitizer was irradiated by pulsed laser (192nm) for laser activation. The laser power was 2W, the scanning speed was 500mm / s, the laser frequency was 20kHz, and the excess laser sensitizer was removed by deionized water. The resulting PA film was immersed in an electroless copper plating solution, and copper-plated at 40° C. for 30 min to obtain a conductive metal pattern.

Embodiment 2

[0047] Example 2. Preparation of Flexible Bendable Metal Patterns

[0048] The laser sensitizer suspension was obtained by stirring and mixing 2wt.% zinc hydroxide with 98wt.% deionized water. The suspension was scraped on a porous PA film with a pore size of 0.05 μm using a scraper, and the solvent was removed by drying. Use pulsed laser (355nm) to irradiate the surface of PA film coated with laser sensitizer for laser activation, laser power 5W, scanning speed 1000mm / s, laser frequency 50kHz, deionized water to remove excess laser sensitizer, and the cleaning The resulting PA film was immersed in an electroless copper plating solution, and copper-plated at 40° C. for 30 min to obtain a conductive metal pattern.

Embodiment 3

[0049] Example 3. Preparation of Flexible Bendable Metal Patterns

[0050] The laser sensitizer suspension was obtained by stirring and mixing 2wt.% copper phosphate and 98wt.% deionized water. The suspension was scraped on a porous PA film with a pore size of 0.05 μm using a scraper, and the solvent was removed by drying. Pulse laser (1064nm) irradiates the surface of the PA film coated with laser sensitizer for laser activation, laser power 8W, scanning speed 2000mm / s, laser frequency 80kHz, deionized water to remove excess laser sensitizer, after cleaning The PA film was immersed in the electroless copper plating solution, and the conductive metal pattern was prepared by copper plating at 40 °C for 30 min.

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Abstract

The invention provides a flexible bendable metal pattern based on a laser technology and a preparation method and application thereof, and belongs to the field of flexible circuits. According to the preparation method, the conductive metal pattern or circuit is prepared on the flexible polymer film coated with the laser sensitizer through laser activation selective metallization. The prepared flexible metal pattern has ultrahigh bending resistance, after 10000 times of bending with the bending radius of 1 mm, the resistance value of the flexible metal pattern is kept basically unchanged, and connection of a metal circuit can be kept under the condition of complete folding. The preparation method does not need a mask or expensive equipment, and compared with a traditional etching method, a silk-screen printing process and an ink-jet printing process, the method is good in production flexibility, easy to operate, controllable in cost and good in universality and has a large-scale industrial application prospect.

Description

technical field [0001] The invention belongs to the field of flexible circuits, and in particular relates to a flexible and bendable metal pattern based on laser technology and a preparation method and application thereof. Background technique [0002] With the rapid development of my country's electronic information industry, my country has become the world's largest manufacturer and exporter of electronic information products. Traditional rigid circuit boards have the advantages of high rigidity, high degree of integration, and strong interconnectivity. They can achieve a high degree of integration of electronic devices during use, and can effectively protect electronic components from physical damage. However, there are also problems with electronic products. It has deficiencies such as bending and folding functions. In today's society, the pace of upgrading of consumer electronic products is accelerating, and it is constantly advancing towards the trend of flexibility. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/18H05K1/03C23C18/16C23C18/20C23C18/31C23C18/32C23C18/38C23C18/42
CPCH05K3/0032H05K3/181H05K3/182H05K1/0313C23C18/1612C23C18/204C23C18/31C23C18/38C23C18/32C23C18/42H05K2201/05H05K2201/0137
Inventor 周涛谢燚张集海
Owner SICHUAN UNIV
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