Nanoscale high-temperature sintered ceramic abrasive and preparation method thereof
A high-temperature sintering and nano-scale technology, applied in the direction of abrasives, grinding/polishing equipment, grinding devices, etc., can solve the problems of short service life, low production efficiency, low processing efficiency, etc., and achieve improved grinding efficiency and long service life The effect of long length and high machining accuracy
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Embodiment 1
[0046] This embodiment provides a nano-scale high-temperature sintered ceramic abrasive, which includes the following components in terms of mass ratio: ordinary abrasive: 40%, additive 2%, the balance is ceramic bond superhard abrasive, and the sum of the above components is 100 %,in:
[0047] Ordinary abrasive is a mixture of sintered dense corundum, alumina and brown corundum mixed in equal proportions;
[0048] The additives include the following components in parts by mass:
[0049] Calcium titanium aluminate: 7 parts, solder: 3 parts, silicon carbide: 3 parts, binder: 10 parts, wetting agent: 2 parts, dispersing agent: 1 part; curing agent: 1 part, V 2 O 5 Sol: 8 parts, sintering additive: 1 part;
[0050] In this embodiment, the solder is Cu-Sn-Ti solder, the wetting agent is dextrin, the dispersant is PEG1000; the curing agent is magnesium oxide; the sintering additive is Mg(NO) 3 ) 2 ·6H 2 O, Ca(NO 3 ) 2 ·4H 2 Mixture of O, ethyl orthosilicate, by mass ratio ...
Embodiment 2
[0073] This embodiment provides a nano-scale high-temperature sintered ceramic abrasive, which includes the following components in terms of mass ratio: ordinary abrasive: 50%, additive 5%, the balance is ceramic bond superhard abrasive, and the sum of the above components is 100 %,in:
[0074] Ordinary abrasive is a mixture of sintered dense corundum, alumina and brown corundum mixed in equal proportions;
[0075] The additives include the following components in parts by mass:
[0076] Calcium titanate aluminate: 20 parts, solder: 8 parts, silicon carbide: 15 parts, binder: 20 parts, wetting agent: 5 parts, dispersant: 3 parts; curing agent: 3 parts, V 2 O 5 Sol: 15 parts, sintering additive: 4 parts;
[0077] In this embodiment, the solder is Cu-Sn-Ti solder, the wetting agent is dextrin, the dispersant is PEG1000; the curing agent is a mixture of magnesium oxide and aluminum sulfate; the sintering additive is Mg(NO) 3 ) 2 ·6H 2 O, Ca(NO 3 ) 2 ·4H 2 Mixture of O, e...
Embodiment 3
[0100] This embodiment provides a nano-scale high-temperature sintered ceramic abrasive, which includes the following components in terms of mass ratio: ordinary abrasive: 45%, additive 4%, the balance is ceramic bond superhard abrasive, and the sum of the above components is 100 %,in:
[0101] Ordinary abrasive is a mixture of sintered dense corundum, alumina and brown corundum mixed in equal proportions;
[0102] The additives include the following components in parts by mass:
[0103] Calcium titanium aluminate: 13 parts, solder: 5 parts, silicon carbide: 8 parts, binder: 15 parts, wetting agent: 4 parts, dispersant: 2 parts; curing agent: 2 parts, V 2 O 5 Sol: 11 parts, sintering additive: 3 parts;
[0104] In this embodiment, the solder is Cu-Sn-Ti solder, the wetting agent is dextrin, the dispersant is PEG1000; the curing agent is alkylene triamine; the sintering additive is Mg(NO) 3 ) 2 ·6H 2 O, Ca(NO 3 ) 2 ·4H 2 Mixture of O, ethyl orthosilicate, by mass ratio...
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