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Single-sided PCB (printed circuit board) and processing technology thereof

A technology for printed circuit boards and processing technology, applied in the fields of printed circuits, printed circuit coatings, printed circuit manufacturing, etc., can solve problems such as signal transmission loss of printed circuit boards, achieve improved dielectric properties, enhance bonding performance, and reduce material effect of density

Active Publication Date: 2022-05-06
珠海市骏德电业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Studies have found that some solder resist inks can cause loss of signal transmission on printed circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Solder resist ink includes the following components by weight: Component A: 40 parts of cured resin, 25 parts of titanium dioxide, 4 parts of photoinitiator, 2 parts of additives; B component: 25 parts of epoxy resin, 2 parts of fumed silica , 20 parts of diluent, 5 parts of auxiliary agent, 15 parts of solvent;

[0050] Cured resins are produced by the following processes:

[0051] 1.1. Mix dicyclopentadiene and aluminum chloride, heat up to 120°C in a nitrogen atmosphere, and keep warm for 1.6h; slowly add divinylbenzene, keep warm for 3.6h; add 5% sodium hydroxide solution, stir for 50min, filtering, washing; distilling the organic phase; dissolving in toluene, extracting with deionized water, repeating several times, and distilling to obtain dicyclopentadiene derivative A;

[0052] 1.2. Take 2,2-bis[(3-amino-4-hydroxy)phenyl]hexafluoropropane, Et3N, Sm(OTf)3 and mix, add ethanol aqueous solution, in nitrogen atmosphere, at 75℃ , slowly add 4-vinylbenzaldehyde, ref...

Embodiment 2

[0063] Solder resist ink includes the following components by weight: Component A: 50 parts of cured resin, 35 parts of titanium dioxide, 7 parts of barium sulfate, 5 parts of photoinitiator, 4 parts of additives; B component: 32 parts of epoxy resin, 10 parts Parts of titanium dioxide, 3 parts of fumed silica, 32 parts of diluent, 8 parts of auxiliary agent, 22 parts of solvent;

[0064] Cured resins are produced by the following processes:

[0065] 1.1. Mix dicyclopentadiene and aluminum chloride, heat up to 125°C in a nitrogen atmosphere, and keep warm for 2 hours; slowly add divinylbenzene, keep warm for 4 hours; add 5% sodium hydroxide solution, stir for 64 minutes, filter, Washing; distilling the organic phase; dissolving in toluene, extracting with deionized water, repeating several times, and distilling to obtain dicyclopentadiene derivative A;

[0066] 1.2. Take 2,2-bis[(3-amino-4-hydroxy)phenyl]hexafluoropropane, Et3N, Sm(OTf)3 and mix, add ethanol aqueous solution,...

Embodiment 3

[0077] Solder resist ink includes the following components by weight: Component A: 60 parts of cured resin, 45 parts of titanium dioxide, 15 parts of barium sulfate, 7 parts of photoinitiator, 7 parts of additives; B component: 40 parts of epoxy resin, 20 parts Parts of titanium dioxide, 5 parts of fumed silica, 45 parts of diluent, 12 parts of auxiliary agent, 30 parts of solvent;

[0078] Cured resins are produced by the following processes:

[0079] 1.1. Mix dicyclopentadiene and aluminum chloride, heat up to 130°C in a nitrogen atmosphere, and keep warm for 2.5 hours; slowly add divinylbenzene, keep warm for 4.5 hours; add 5% sodium hydroxide solution, stir for 75 minutes, filtering, washing; distilling the organic phase; dissolving in toluene, extracting with deionized water, repeating several times, and distilling to obtain dicyclopentadiene derivative A;

[0080]1.2. Mix 2,2-bis[(3-amino-4-hydroxy)phenyl]hexafluoropropane, Et3N and Sm(OTf)3, add ethanol aqueous solutio...

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Abstract

The invention discloses a single-sided PCB (printed circuit board) and a processing technology thereof. The processing technology comprises the following steps: (1) pretreatment: cutting and cleaning a copper-clad substrate; (2) preparing a circuit: printing a circuit pattern, performing UV drying, etching and removing a film; (3) solder resist printing: coating solder resist ink, and performing UV drying; (3) character printing: printing characters on the back surface and the front surface of the copper-clad substrate, and performing UV drying; and (5) post-processing: drilling a positioning hole and punching. According to the invention, dicyclopentadiene and benzothiazole are introduced into the molecular structure of the cured resin, so that the cured resin has low molar polarizability and low dielectric constant; when the epoxy resin is synergistically cured with epoxy resin, due to the large steric hindrance effect, the crosslinking density of the epoxy resin is reduced, a cured product with larger molecular space gap and lower density is formed, and the dielectric property of the prepared cured resin after being cured with the epoxy resin is improved; meanwhile, due to the strong electron withdrawing capability, the bonding performance of the prepared solder mask layer and the circuit pattern can be enhanced.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a single-sided PCB printed circuit board and its processing technology. Background technique [0002] PCB, also known as printed circuit board, is an important electronic component of electronic components and a carrier for electrical interconnection of electronic components. Or inkjet printing and other methods to apply solder resist ink, and then cured to form a protective layer of solder resist ink to protect the circuit. With the advent of the 5G era, electronic information products have entered the gigahertz (GHz) era, and high-speed printed circuits have gradually become a research hotspot. Studies have found that some solder resist inks can cause loss of signal transmission on printed circuit boards. Therefore, we propose a single-sided PCB printed circuit board and its processing technology. Contents of the invention [0003] The object of the present inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B41M7/00B41M1/12
CPCH05K3/0091H05K3/0047H05K3/005B41M1/12B41M7/0081
Inventor 黎斌尚晴晴张荣敏
Owner 珠海市骏德电业有限公司
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