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Formula and preparation method of toughened epoxy resin

A tough epoxy resin and formulation technology, which is applied in the formulation of epoxy resin and the field of epoxy resin preparation, can solve the problems of small average molecular weight and poor toughness effect, and achieve enhanced mechanical strength, enhanced toughness effect, and good dilution effect Effect

Inactive Publication Date: 2022-04-12
广州惠利电子材料有限公司
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

The epoxy resin produced by this method has a good dilution effect with epoxy resin, but the average molecular weight is small, and the toughness effect in the epoxy resin curing system is poor.

Method used

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Examples

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Embodiment Construction

[0013] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] The formula of the toughened epoxy resin is: six raw materials such as bisphenol A epoxy, polyethylene glycol, benzyl alcohol, epoxy silane coupling agent, sodium hydroxide and benzene. Bisphenol A epoxy, polyethylene glycol, benzyl alcohol and epoxy silane coupling agent form a toughened epoxy resin reaction system A, and the epoxy silane coupling agent is bis(dioctyl pyrophosphate acyloxy) Ethylene titanate-acrylamide chelate increases the adhesive density, polyethylene glycol PEG is used to enhance the toughness of the sys...

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PUM

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Abstract

The preparation method comprises the following steps: putting 70-85% of bisphenol A epoxy resin, 1-10% of polyethylene glycol, 10-25% of benzyl alcohol and 0.1-5% of an epoxy silane coupling agent into a reaction kettle, carrying out a heating reaction for 6 hours, stirring at 60 DEG C, dropwise adding a sodium hydroxide aqueous solution, adding benzene, heating to 55-75 DEG C, adding acetic acid for neutralization, and carrying out cooling to room temperature; under the condition that the hardness, the glass transition temperature TG and the transparency are not reduced, the adhesive density is improved, the flexibility is enhanced, the mechanical strength is strengthened, meanwhile, the dilution effect of the epoxy resin is good through reaction of multiple systems, and the toughness effect in an epoxy resin curing system is well improved.

Description

technical field [0001] The invention belongs to chemical materials, in particular to a formula for preparing epoxy resin and a method for preparing epoxy resin. Background technique [0002] Epoxy resin is a kind of high molecular polymer, which is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of epoxy group, various compounds containing active hydrogen can be used to open the ring and cure Cross-linking creates a network structure, so it is a thermosetting resin. [0003] The excellent physical, mechanical and electrical insulation properties of epoxy resin, the bonding performance with various materials, and the flexibility of its use process are not available in other thermosetting plastics. Therefore, it can be made into coatings, composite materials, casting materials, adhesives, molding materials and injection molding materials, and is widely used in various fields of the national economy. [0004] Epoxy resin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L71/02C08K5/5435
Inventor 朱行春
Owner 广州惠利电子材料有限公司
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