Heat-conducting gel and preparation method thereof

Abstract

The invention discloses heat-conducting gel and a preparation method thereof. The heat-conducting gel comprises the following raw material components in parts by mass: 1-20 parts of side chain vinyl silicone oil; 1-20 parts by mass of double-end hydrogen-containing silicone oil; 1-20 parts by mass of double-end vinyl silicone oil; 0.01 to 1.0 part by mass of a catalyst; 0.001 to 0.5 part by mass of an inhibitor; and 60-90 parts by mass of a heat-conducting filler. Starting from the design of a heat-conducting gel molecular chain structure, a large number of molecular chain physical entanglement networks, chemical cross-linked networks and heat-conducting filler networks are introduced into an organic silicon elastomer, and the characteristic that physical entanglement points slide along with molecular chains through external force is utilized, so that the ultrahigh toughness (200-8000J/m < 2 >) of the organic silicon thermal interface material is realized; the high thermal conductivity (0.5-8.0 W/mK) and the low contact thermal resistance (2.00-0.05 DEG C * cm < 2 >/W) of the organic silicon thermal interface material are realized at the same time by utilizing a thermal conduction path formed by the interaction between the thermal conduction filler and molecular chain entanglement.

Description

technical field [0001] The invention relates to the technical field of thermally conductive gel, in particular to a thermally conductive gel and a preparation method thereof. Background technique [0002] With the development trend of miniaturization and integration of electronic components, the industry first needs to solve the problem of heat dissipation in order to ensure the stability, reliability and durability of electronic components. Due to the manufacturing process, a large number of pores will be generated after the rough surface contact between the heat source and the heat sink, and the low thermal conductivity of the air seriously hinders the transmission of heat. In order to solve this problem, people proposed a filling thermal interface material (Thermal interfere materials, TIMs) to replace the original air gap, by filling the organic silicon material with inorganic thermally conductive fillers to improve its thermal conductivity and heat transfer efficiency ...

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Problems solved by technology

However, neither of them paid attention to the thermal contact resistance, which plays a crucial role in the thermal conductivity of thermal interface materials, which limits the practical application of thermal interface materials.

[0005] At the same time, there are few reports about the toughness of thermally conductive gels at home and abroad.

Zhou Yong et al. Use tensile strength to express toughness (Zhou Yong. Preparation and properties of sepiolite-based ductile and thermally conductive consolidated materials[J]. China Non-Metallic Mineral Industry Guide, 2021(03):6-9. ), ignoring the influence of its elongation at break on the toughness of the material, and blindly pursuing mechanical properties while ignoring its thermal conductivity

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