Resin composition and application

Abstract

The invention provides a resin composition, which comprises the following components in parts by weight: 5 to 30 parts of alicyclic epoxy resin; 10-60 parts by weight of aromatic epoxy resin; 5 to 60 parts by weight of bismaleimide resin; wherein the molecular structural formula of the alicyclic epoxy resin is shown as a formula (1); in the formula (1), n is an integer of 1-10. The resin composition contains aliphatic epoxy resin and bismaleimide resin with specific structures, and prepregs and laminated boards prepared from the resin composition have the characteristics of high CTI value and Tg value, excellent humidity and heat resistance, low water absorption, excellent flame retardance and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition and its application. Background technique [0002] Since the safety and reliability of electronic products are related to the safety of life and property, copper-clad laminates are an important part of printed circuit boards in electronic products. After the copper-clad laminate is made into a circuit board, if it works in a harsh environment such as humidity, high temperature and high pressure, and pollution, it will form an electrolyte, which will cause leakage and discharge under the condition of electricity, so that the insulation of the copper-clad laminate Carbonization and conduction of the base material may eventually lead to a fire. Therefore, it is required that the insulating substrate of the copper-clad laminate has an excellent comparative tracking index (CTI for short). [0003] In the prior art, there are generally the following way...

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Problems solved by technology

[0003] In the prior art, there are generally the following ways to improve the CTI of the insulating base material of the copper-clad laminate, such as by adding a large amount of aluminum hydroxide (filling amount greater than 60%), because aluminum hydroxide can release water at high temperature, water once On the one hand, it can dilute the carbon particles, so that the carbon particles are not easy to conduct, on the other hand, the water can also play a role in cooling; in addition, aluminum hydroxide can oxidize the carbon particles into carbon monoxide at high temperature, and the generated aluminum oxide has the function of heat conduction and heat insulation , although this method can improve CTI, a large amount of aluminum hydroxide will cause on the one hand the deterioration of the bonding force between the insulating substrate and the copper foil and affect the processability of the printed circuit board (PCB) (the drill bit is worn out, etc.), and the other On the one hand, aluminum hydroxide can release water at 200-300°C, and the water will cause the copper-clad laminate to burst and delaminate during the process of PCB manufacturing (288°C immersion tin)

In addition, such as the invention patent CN1022861A, the purpose of improving the CTI of the insulating substrate is mainly achieved by adding hydrogenated bisphenol A epoxy resin, alicyclic epoxy resin, phenolic resin curing agent and part of aluminum hydroxide, but this method has significant The disadvantage is that the flame retardancy is poor, and the flame retardancy cannot reach UL94 V-0, which is contrary to the laws and regulations on the safety of electronic products

Another example is the invention patent CN104479295A, which mainly combines ordinary epoxy resin (phosphorus-containing epoxy), alicyclic epoxy and dicyclopentadiene epoxy resin and cures it through acid anhydride. The CTI can be greater than the requirement of 600V, and avoids the The processability, resistance and adhesion of the substrate are reduced by adding a large amount of aluminum hydroxide. Although the CTI can reach 600V and the flame retardancy can reach UL94 V-0 in this method, the main problem is the water absorption of the substrate. High water absorption rate and poor resistance to heat and humidity, etc., and high water absorption rate has the factor of CTI instability

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