Lateral double diffused field effect transistor, manufacturing method, chip and circuit
A technology of field effect transistors and lateral double diffusion, which is applied in the direction of circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of driving ability and speed difference, and achieve increased speed, improved carrier mobility, and weakened band The effect of scattering
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[0031] The specific implementation of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that this
[0034] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
[0038] A first drain 10 is formed in the first tensile strain region 7, a second drain 11 is formed in the second tensile strain region 8, and a P-type body is formed.
[0039] Through the lateral double diffusion field effect transistor of the embodiment of the present invention, a strained material is embedded in the drift region to form
[0040] Further, the first tensile strain region 7 and the second tensile strain region 8 are hexagonal structures.
[0042] Further, the first tensile strain region 7 and the second tensile strain region 8 include silicon carbide.
[0044] Further, the first tensile strain region 7 and the second tensile...
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