Optical element polishing die filling adhesive and preparation method thereof

A technology of optical components and filling glue, which is applied in the direction of manufacturing tools, metal processing equipment, abrasives, etc., can solve the problems of easy deformation of polishing molds, low processing efficiency, and low processing quality, and achieve stable polishing surface quality, enhanced stability, The effect of strong heat resistance

Pending Publication Date: 2022-03-22
安徽光智科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the problems existing in the prior art, one of the purposes of the present invention is to provide a polishing mold filling glue for optical elements, which can effectively overcome the problems of easy deformation, low processing quality and low processing efficiency of the existing polishing molds

Method used

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  • Optical element polishing die filling adhesive and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0039] Prepare 10 kg of asphalt, 1 kg of beeswax, 7 kg of rosin and 1 kg of alumina with a particle size of 0.1um by weight, and prepare the polishing mold filling compound according to the following process steps:

[0040] S1. Melt the rosin at a temperature of 60-80°C, stir while adding beeswax, wait until the beeswax and rosin are mixed evenly, and then add alumina powder while stirring to obtain a mixture;

[0041] S2. Melt the asphalt at a temperature of 80-150°C and add it to the mixture obtained in step S1, continue to stir evenly, and continue to heat;

[0042] S3. Keep the asphalt-added mixture obtained in step S2 at a temperature of 350° C. for 60 hours to obtain a polishing mold filling compound with a microporous structure uniformly distributed on the surface.

[0043] The pore diameter of the microporous structure on the surface of the polishing film filler described in this embodiment is 460-524 μm.

[0044] The resulting polishing mold is filled with glue to ma...

Embodiment 2

[0046] Prepare 5 kilograms of asphalt, 0.5 kilograms of beeswax, 3.5 kilograms of rosin and 1 kilogram of alumina with a particle size of 0.1um by weight, and prepare the polishing mold filling glue according to the following process steps:

[0047] S1. Melt the rosin at a temperature of 60-80°C, stir while adding beeswax, wait until the beeswax and rosin are mixed evenly, and then add alumina powder while stirring to obtain a mixture;

[0048] S2. Melt the asphalt at a temperature of 80-150°C and add it to the mixture obtained in step S1, continue to stir evenly, and continue to heat;

[0049] S3. Heat the asphalt-added mixture obtained in step S2 at a temperature of 400° C. for 35 hours to obtain a polishing mold filling compound with a microporous structure evenly distributed on the surface.

[0050] The pore diameter of the microporous structure on the surface of the polishing film filler described in this example is 184-263 μm.

Embodiment 3

[0052] Prepare 15 kilograms of asphalt, 1.5 kilograms of beeswax, 10 kilograms of rosin and 5 kilograms of alumina with a particle size of 0.1um by weight, and prepare the polishing mold filling glue according to the following process steps:

[0053] S1. Melt the rosin at a temperature of 60-80°C, stir while adding beeswax, wait until the beeswax and rosin are mixed evenly, and then add alumina powder while stirring to obtain a mixture;

[0054] S2. Melt the asphalt at a temperature of 80-150°C and add it to the mixture obtained in step S1, continue to stir evenly, and continue to heat;

[0055]S3. Heat the asphalt-added mixture obtained in step S2 at a temperature of 500° C. for 100 hours to obtain a polishing mold filling compound with evenly distributed micropore structure on the surface.

[0056] The pore diameter of the microporous structure on the surface of the polishing film filler described in this embodiment is 230-356 μm.

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Abstract

The invention belongs to the technical field of optical processing, and discloses an optical element polishing die filling adhesive and a preparation method thereof. The polishing filling adhesive comprises the following components in parts by weight: 5-15 parts of asphalt; 0.5 to 1.5 parts of beewax; 3.5 to 10 parts of rosin; 1-5 parts of aluminum oxide; microporous structures are uniformly distributed on the surface of the polishing film filling adhesive. The polishing die filling adhesive has relatively high hardness, also has certain plasticity and adhesion, and can effectively ensure that the surface shape of zinc selenide subjected to optical processing is flat; the polishing solution is high in heat resistance and small in deformation, can enhance the quality stability of a polished surface, can effectively shorten the element machining period, saves machining auxiliary materials, is used for machining a soft infrared crystal lens, gives consideration to surface type, surface roughness and smoothness, and is stable in quality of the polished surface and high in polishing efficiency.

Description

technical field [0001] The invention belongs to the technical field of optical processing, and more specifically relates to an optical element polishing mold filling glue and a preparation method thereof. Background technique [0002] At present, most of the domestic processing optical components adopt classical polishing method and high-speed polishing method. The classical polishing method uses a polishing mold made of a metal substrate coated with polishing pitch to polish the components. In the polishing process, the polishing disc plays a very important role. First of all, the polishing powder in the processing area needs to rely on the support of the polishing disc to exert force on the surface of the polished object to achieve material removal on the surface of the polished object. Therefore, under the action of the circulating flow of the polishing liquid, the micro-deformation of the polishing disc and the microhardness of the local area of ​​the polishing disc ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/20
CPCB24D3/20
Inventor 杨安黄雪丽尹士平
Owner 安徽光智科技有限公司
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