Method for detecting binding force of DPC ceramic copper-plated substrate

A detection method and technology of binding force, applied in measuring devices, instruments, scientific instruments, etc., can solve the problems of flow to the client, misjudgment, uneven temperature of products, etc. quick effect

Pending Publication Date: 2022-02-01
江苏富乐华半导体科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, using a heating platform to bake products, for destructive tests, only sampling inspections are performed on each batch of products
This method cannot ensure that all defective products can be effectively detected, and there is a risk of flowing to the client; in addition, the heating platform is baked, and the product is heated unevenly, which may also lead to misjudgment.

Method used

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  • Method for detecting binding force of DPC ceramic copper-plated substrate
  • Method for detecting binding force of DPC ceramic copper-plated substrate
  • Method for detecting binding force of DPC ceramic copper-plated substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] S1. Prepare the baking jig

[0042] 1). Preparation of polybenzimidazole solution

[0043] a. Add 200g of polyphosphoric acid and 4g of 3,3',4,4'-tetraaminodiphenyl ether into the reaction vessel, pass through nitrogen protection, heat the oil bath to 160°C, and keep it warm for 12 hours. Stir continuously at a rate;

[0044] b. After the heat preservation is completed, the temperature is raised to 220° C., and 7 g of phosphorus pentoxide and 3.5 g of terephthalic acid are continuously added to the reaction vessel, and after 12 hours of reaction, a polymer is obtained;

[0045] c. Pour the polymer into ammonia water and soak for 24 hours, filter, wash with deionized water, place it in a vacuum dryer, and dry it in vacuum at 100°C. After drying, the polybenzimidazole polymer can be obtained;

[0046] d. Weigh 100g of the prepared polybenzimidazole polymer, add it into 1500g dimethyl sulfoxide, and stir until dissolved to obtain the polybenzimidazole solution;

[0047]...

Embodiment 2

[0055] S1. Prepare the baking jig

[0056] 1). Preparation of polybenzimidazole solution

[0057] a. Add 200g of polyphosphoric acid and 4g of 3,3',4,4'-tetraaminobiphenyl into the reaction vessel, pass through nitrogen protection, heat the oil bath to 160°C, and keep it warm for 12 hours. Stir continuously at a rate;

[0058] b. After the heat preservation is over, raise the temperature to 220°C, continue to add 7g of phosphorus pentoxide and 3.5g of 4,4'-dicarboxydiphenylsulfone into the reaction vessel, and react for 12 hours to obtain a polymer;

[0059] c. Pour the polymer into a sodium hydroxide solution with a pH value of 8 and soak for 24 hours, filter it, wash it with deionized water, put it in a vacuum dryer, and dry it in a vacuum at 100 ° C. After drying, it can be Obtain polybenzimidazole polymer;

[0060] d. Weigh 100g of the prepared polybenzimidazole polymer, add it into 1500g dimethyl sulfoxide, and stir until dissolved to obtain the polybenzimidazole solut...

Embodiment 3

[0069] S1. Prepare the baking jig

[0070] 1). Preparation of polybenzimidazole solution

[0071] a. Add 200g of polyphosphoric acid and 4g of 3,3',4,4'-tetraaminodiphenyl sulfide into the reaction vessel, pass through nitrogen protection, heat the oil bath to 120°C, and keep it warm for 48 hours. Stirring at a rate of 60rpm;

[0072] b. After the heat preservation is completed, heat up to 200°C, continue to add 7g of phosphorus pentoxide and 3.5g of 4,4'-dicarboxydiphenylsulfone into the reaction vessel, and react for 24 hours to obtain a polymer;

[0073] c. Pour the polymer into a sodium hydroxide solution with a pH value of 8 and soak for 24 hours, filter it, wash it with deionized water, put it in a vacuum dryer, and dry it in a vacuum at 100 ° C. After drying, it can be Obtain polybenzimidazole polymer;

[0074] d. Weigh 100g of the prepared polybenzimidazole polymer, add it into 1500g dimethyl sulfoxide, and stir until dissolved to obtain the polybenzimidazole soluti...

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Abstract

The invention discloses a method for detecting a binding force of a DPC ceramic copper-plated substrate. The method comprises the following steps: producing a baking jig, coating the surface of the jig with a polybenzimidazole coating, reducing the surface hardness of the jig to load the DPC ceramic copper-plated substrate, and heating the DPC ceramic substrate by using a high-temperature nitrogen oven to comprehensively detect batch products. In the detection process, nitrogen atmosphere protection exists in the furnace, products cannot be oxidized or damaged, the products can be continuously used, and therefore the risk that defective products flow into customers and inconvenience is caused due to sampling detection omission is reduced, and the method is widely applied to the technical field of DPC ceramic copper-plated substrates.

Description

technical field [0001] The invention relates to the technical field of DPC ceramic copper-plated substrates, in particular to a method for detecting the binding force of DPC ceramic copper-plated substrates. Background technique [0002] DPC is also called Direct Plated Copper. It is mainly used in semiconductor refrigerators, optical communication modules, LED heat dissipation substrates and solar cell components, etc. The process first pre-cleanes the ceramic substrate, deposits a Ti / Cu layer on the surface of the substrate as a seed layer by vacuum sputtering, and then completes the circuit production by photolithography, development, and etching processes, and finally increases it by electroplating. The thickness of the line, after the photoresist is removed, the substrate production is completed. In the process of magnetron sputtering, if the ceramic chip is not cleaned thoroughly or impurities enter the sputtered layer, resulting in a non-dense sputtered layer, poor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/00
CPCG01N25/00
Inventor 余龙贺贤汉孔进进马敬伟王松张进
Owner 江苏富乐华半导体科技股份有限公司
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