Preparation method of single-component room-temperature-curing high-temperature-resistant adhesive
A room-temperature-curing, high-temperature-resistant technology, applied in the direction of adhesives, polymer adhesive additives, adhesive types, etc., can solve the problems of insufficient temperature-resistant strength at 250°C and cumbersome construction process, etc., and achieve simple and easy production process, High retention rate, reasonable effect of preparation
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specific Embodiment approach 1
[0018] Embodiment 1: This embodiment is a preparation method of a one-component room temperature curing high temperature resistant adhesive, which is carried out according to the following steps:
[0019] 1. Weigh 70 to 95 parts of tetraglycidylamine epoxy resin, 5 to 30 parts of AFG-90 epoxy resin and 10 to 50 parts of toughening agent by mass, and weigh 70 to 95 parts of four Glycidylamine type epoxy resin, 5 parts to 30 parts of AFG-90 epoxy resin and 10 parts to 50 parts of toughening agent are added to the reaction kettle, and the 2 Under the condition that the atmosphere and temperature are 145℃~155℃, stir for 1h~4h, and cool to room temperature to obtain product A;
[0020] 2. Weigh 10 to 50 parts by mass of maleic anhydride, 5 to 30 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 2 to 20 parts of 1, 4,5,8-Naphthalene tetracarboxylic anhydride, 10 to 50 parts of maleic anhydride, 5 to 30 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 2 ...
specific Embodiment approach 2
[0030] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the toughening agent described in step 1 is one or both of carboxyl-terminated liquid nitrile rubber and epoxy-terminated liquid nitrile rubber. mixture. Others are the same as the first embodiment.
specific Embodiment approach 3
[0031]Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the tetraglycidylamine epoxy resin described in step 1 is AG-80 epoxy resin or MF-4101 epoxy resin. The tetraglycidylamine type epoxy resin described in one is AG-80 epoxy resin or MF-4101 epoxy resin. Others are the same as in the first or second embodiment.
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