A composite vc radiator containing copper/diamond composite configuration liquid-absorbing core and its preparation method

A diamond, absorbent core technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating renovation, etc., can solve the problems of low thermal expansion, small diamond content, limited improvement in thermal conductivity, etc. The effect of small resistance, improved wettability, and improved overall heat transfer performance

Active Publication Date: 2022-06-17
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the core component of the VC board, the capillary wick is mostly copper-based at present, but due to the low thermal conductivity of copper itself, it will be difficult to meet higher power requirements in the future Cooling needs
As the material with the best thermal conductivity in nature, diamond has both high thermal conductivity and low thermal expansion characteristics. It has unique advantages as a thermal conductivity enhancing material. However, at present, diamonds are composited with copper liquid-absorbing cores by coating methods, and the diamond content is small. Limited improvement in thermal conductivity

Method used

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  • A composite vc radiator containing copper/diamond composite configuration liquid-absorbing core and its preparation method
  • A composite vc radiator containing copper/diamond composite configuration liquid-absorbing core and its preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0059] Preparation of copper / diamond sintered framework:

[0060] Take diamond particles with a particle size of 150 μm (100 mesh) to deposit a Cr transition layer, the magnetron sputtering power is 200w, and the deposition time is 20 minutes to obtain diamond particles with a thickness of 2 μm containing a Cr transition layer, and then on the diamond particles containing Cr overcoating. The surface is copper-plated. The specific copper-plating process is as follows: magnetron sputtering power is 200w to obtain a copper cladding layer with a thickness of 2 μm, and then the diamond particles containing the copper cladding layer and the copper powder with a particle size of 150 μm are in a mass ratio of 40: 60 mixed to obtain mixed powder, loosely packed in a graphite mold, and sintered in a hydrogen atmosphere. During sintering, the temperature was first heated to 750°C at a rate of 5°C / min, and then heated to 900°C at a rate of 3.3°C / h. , holding time for 60min, and then air-c...

Embodiment 2

[0071] Preparation of copper / diamond sintered body:

[0072] Take diamond particles with a particle size of 250 μm (60 mesh) to deposit a Cr transition layer, the magnetron sputtering power is 200 W, and the deposition time is 90 min to obtain diamond particles with a thickness of 9 μm containing a Cr transition layer, and then the diamond particles containing Cr overcoating are obtained. The surface is copper-plated, and the specific copper-plating process is: magnetron sputtering power 200W, deposition time 90min to obtain a copper cladding layer with a thickness of 9μm, and then the diamond particles containing the copper cladding layer and the particle size of 150μm copper powder according to the quality Mixed at a ratio of 50:50 to obtain mixed powder, loosely packed in a graphite mold, and sintered in a hydrogen atmosphere. During sintering, the temperature was first heated to 750°C at a rate of 300°C / h (5°C / min), and then sintered at 200°C. The temperature was raised to...

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Abstract

The invention discloses a composite VC radiator containing a copper / diamond composite liquid-absorbing core and a preparation method thereof. The VC radiator includes a lower shell plate, and a concave cavity is arranged at the center of the inner surface of the lower shell plate. The central position of the outer surface is provided with a boss consistent with the plane size of the concave cavity, and the surface of the convex platform or the surface of the concave cavity is provided with a copper / diamond composite plate. When the surface of the convex platform is provided with a copper / diamond composite plate, the concave cavity The surface is directly provided with a copper / diamond composite configuration liquid-absorbing core; when the surface of the concave cavity is provided with a copper / diamond composite board, then a copper / diamond composite configuration liquid-absorbent core is arranged on the surface of the copper / diamond composite board, and the copper / diamond composite board is provided with a copper / diamond composite configuration liquid-absorbent core. The diamond composite configuration liquid-absorbing core is a three-dimensional porous structure, which uses a copper / diamond sintered body as a substrate, a diamond layer is arranged on the surface of the substrate, and a metal hydrophilic layer is arranged on the surface of the diamond layer. The composite VC heat sink maximizes the improvement of heat dissipation performance under the cooperation of structure and material.

Description

technical field [0001] The invention discloses a composite VC radiator containing a copper / diamond composite configuration liquid-absorbing core and a preparation method thereof, belonging to the technical field of thermal management equipment. Background technique [0002] With the advent of the 5G era, in order to meet the growing needs of use, all kinds of electronic devices have been updated and continuously developed in the direction of miniaturization, high integration and high performance. Under the rapidly increasing operating power and smaller volume requirements, the power density of electronic components has surged. Electronic components perform high-power work in such a small area, which is bound to bring amazing heat. When the heat cannot be dissipated in time, it will lead to failure, damage, and even meltdown of electronic devices. The problem of heat dissipation of high-power electronic devices has become a bottleneck for the application of new-generation e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/046H05K7/20336F28F21/085F28F2255/06F28F2255/18H01L23/427H01L23/3733H01L23/3732C22C26/00B22F7/064B22F2201/20B22F2301/10B22F2302/406F28F21/04
Inventor 魏秋平周科朝马莉王熹
Owner CENT SOUTH UNIV
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