Impinging flow double-layer flow guide micro-channel heat sink suitable for high heat flux density device

Abstract

The invention relates to an impinging flow double-layer flow guide micro-channel heat sink suitable for a high heat flux density device. The impinging flow double-layer flow guide micro-channel heat sink has efficient and uniform convective heat exchange performance, low pressure loss and high overall heat exchange characteristics. The stroke of a coolant in the channel can be greatly shortened, so that the pressure drop loss is reduced, and the working stability of the system is improved; secondly, a periodical cut-off type middle layer can reduce the pressure drop resistance of the channel, meanwhile, the coolant on the upper layer and the lower layer generates a turbulent flow effect, a flowing boundary layer is destroyed, and the heat transfer characteristic is enhanced; thirdly, the upper and lower channels are connected, so that coolant flowing paths are increased, turbulent flow areas are increased, and the overall heat dissipation effect of the system is improved; and most importantly, the coolant on the upper layer and the lower layer can be remarkably mixed through the flow guide structure of the middle cut-off area, the cooling performance of the upper-layer coolant is greatly improved, and therefore the heat transfer efficiency is improved.

Description

Technical field [0001] The present invention pertains to reinforced microchannel cooling technology, and more particularly, to a device suitable for the high heat flux impinging stream flow double microchannel heat sink. Background technique [0002] With the Sino-US trade war broke out in recent days, the bottleneck of domestic research and development of electronic chip technology concern the masses. In the field of energy and power technology, bio-chemical, aerospace and other advanced engineering, high-density, ultra-precision micro-electronics heat exchange system heat load is increasing. Heat flux devices such as aerospace VLSI, laser mirrors, and other microelectronic assembly equipment IDF than 10 3 W / cm 2 In the bottom area is very small and the heat dissipating transient high heat flux conditions, if that is not effectively reduce the surface temperature of the device, the device to maintain the uniformity of the surface temperature distribution will result in device ...

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention is: in order to solve the technical problem that the heat dissipation capacity of the cooling working medium fluid in the upper channel of the existing double-layer micro-channel heat sink is low, and the cooling potential is not fully developed, the present invention relates to a high-efficiency and uniform convective heat transfer performance , low pressure loss and high overall heat transfer characteristics, an impingement jet double-layer flow guide structure micro-channel heat sink suitable for thermal management of high heat flux devices

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