Monocrystalline silicon texturing additive with strong dirt-removing power and application thereof

Abstract

The invention discloses a monocrystalline silicon texturing additive with strong decontamination capability and an application thereof. The texturing additive comprises the following components in percentage by mass: 1%-6% of a first surfactant, 2%-5% of a second surfactant, 3%-5% of an ether defoaming agent, 0.5%-3% of a nucleating agent, 1%-2% of a cosolvent, 0-0.1% of a chelating agent and the balance being deionized water. The invention discloses the novel monocrystalline silicon texturing additive with strong decontamination capability, and an unconventional surfactant has a wrapping effect only when reaching a certain concentration and is not limited by the critical micelle concentration, so that the decontamination effect of the texturing additive is greatly improved, and the cleanliness of the surface of a textured silicon wafer is improved.

Description

technical field [0001] The invention relates to a monocrystalline silicon chip texturing additive, in particular to a monocrystalline silicon texturing additive with strong decontamination capability and its application. Background technique [0002] At present, the cutting process of monocrystalline silicon wafers mainly adopts the diamond wire cutting process. The mortar used for cutting usually uses silicon carbide powder as the abrasive, but the powder with silicon carbide particles smaller than 2 μm does not have cutting ability. In addition, a large amount of Micropowder such as silicon powder and iron powder is mixed into the mortar to form a film. As the cutting progresses, the content of the micropowder in the mortar will become higher and higher. When the amount of micropowder is large enough, it will adhere to the surface of the silicon wafer, making it difficult to Clean up. With the continuous development of cutting technology towards thinner lines and thinner ...

AI Technical Summary

Problems solved by technology

The surfactant concentration in the above texturizing additives is lower than the critical micelle concentration, so it is impossible to form solubilized micelles for the dirt, and the dirt will be deposited again, which greatly limits the decontamination ability of the texturizing additives

However, in the actual production process, if the decontamination ability of the texturing additive is improved by simply increasing the concentration of the surfactant, it will cause too much surfactant to be adsorbed on the surface of the silicon wafer, which will cause the texturing reaction to slow down and alkali Adverse consequences such as increased dosage