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Transparent polyimide containing hydrogen bonds as well as preparation method and application of transparent polyimide

A technology of transparent polyimide and hydrogen bonding, which is applied in the field of high-performance transparent polyimide film materials and its preparation, and can solve the problems of low CTE heat resistance, solvent resistance, low heat resistance, poor solvent resistance, etc. problems, to achieve excellent solvent resistance, excellent thermal stability, and improve the effect of adhesion

Pending Publication Date: 2021-06-29
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Aiming at the problems of high CTE, low heat resistance and poor solvent resistance of the current colorless polyimide film, the technical purpose of the present invention is to provide a polyimide film with low CTE, high heat resistance and high solvent resistance. Transparent polyimide film and preparation method thereof

Method used

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  • Transparent polyimide containing hydrogen bonds as well as preparation method and application of transparent polyimide
  • Transparent polyimide containing hydrogen bonds as well as preparation method and application of transparent polyimide
  • Transparent polyimide containing hydrogen bonds as well as preparation method and application of transparent polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072]Under nitrogen protection, add 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl TFDB (1.6172g, 5.05mmol) and biphenyltetracarboxylic dianhydride in a three-necked flask equipped with mechanical stirring BPDA (1.4711g, 5mmol), ensure that the molar ratio of TFDB and BPDA is 1.01:1, add anhydrous dimethylacetamide DMAc (20mL), make the solution solid content be 13%, react at room temperature for 5 hours; Add TFDB ( 0.6244g, 1.95mmol) and 9.5mL DMAc, after TFDB is completely dissolved, add terephthaloyl dichloride TPC (0.4060g, 2mmol) to form a gel, then add propylene oxide (0.6mL, 16.8mmol), and react at room temperature After 3 hours, a polyamic acid-polyamide solution with a solid content of 13% was obtained, which was transferred to a refrigerator at 0° C. and stored overnight. Then scrape it onto a glass plate, heat it at a temperature of 60°C to 300°C at a rate of 1-10°C / min for 2-10 hours, and cool to room temperature to obtain transparent polyimide with a thickness of 5...

Embodiment 2

[0075] Under nitrogen protection, add 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl TFDB (1.7773g, 5.55mmol) and biphenyltetracarboxylic dianhydride to a three-necked flask equipped with mechanical stirring BPDA (1.6182g, 5.5mmol), ensure that the molar ratio of TFDB to BPDA is 1.01:1, add anhydrous dimethylacetamide DMAc (24mL) to make the solution solid content 13%, react at room temperature for 5 hours; then add TFDB (0.4643g, 1.45mmol) and 9.5mL DMAc, after TFDB is completely dissolved, add terephthaloyl dichloride TPC (0.3045g, 1.5mmol), form a gel, then add propylene oxide (0.45mL, 12.6mmol), React at room temperature for 3 hours to obtain a polyamic acid-polyamide solution with a solid content of 13%, which was transferred to a refrigerator at 0° C. for overnight storage. Then scrape it onto a glass plate, heat it at a temperature of 60°C to 300°C at a rate of 1-10°C / min for 2-10 hours, and cool to room temperature to obtain transparent polyimide with a thickness of 50 μ...

Embodiment 3

[0077] Under nitrogen protection, add 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl TFDB (1.9374g, 6.05mmol) and biphenyltetracarboxylic dianhydride to a three-necked flask equipped with mechanical stirring BPDA (1.7653g, 6mmol), ensure that the molar ratio of TFDB to BPDA is 1.01:1, add anhydrous dimethylacetamide DMAc (26.5mL), so that the solid content of the solution is 13%, react at room temperature for 5 hours; then add TFDB (0.3362g, 0.95mmol) and 9.5mL DMAc, after TFDB is completely dissolved, add terephthaloyl dichloride TPC (0.2030g, 1mmol) to form a gel, then add propylene oxide (0.3mL, 8.4mmol), room temperature After reacting for 3 hours, a polyamic acid-polyamide solution with a solid content of 13% was obtained, which was transferred to a refrigerator at 0° C. for overnight storage. Then scrape it onto a glass plate, heat it at a temperature of 60°C to 300°C at a rate of 1-10°C / min for 2-10 hours, and cool to room temperature to obtain transparent polyimide with ...

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Abstract

The invention discloses transparent polyimide containing hydrogen bonds as well as a preparation method and application of the transparent polyimide. The transparent polyimide is a block copolymer consisting of a polyamide block containing a -NH-CO- structure and a polyimide block with a relatively large molecular weight, and the proportion of clustered hydrogen bonds is controlled by controlling the relative proportion of the two blocks, so that the thermal expansion coefficient of the polymer is regulated and controlled, and a transparent polyimide film with low thermal expansion coefficient, high heat resistance and high organic solvent resistance can be prepared. Based on the film, flexible devices such as flexible carbon nanotube transistor devices, flexible oxide semiconductor devices and flexible sensors can be prepared.

Description

technical field [0001] The invention belongs to the field of polyimide material preparation and application, and in particular relates to a high-performance transparent polyimide film material and its preparation method and application. Background technique [0002] Flexible transparent substrates are an important part of flexible transparent electronic devices. As a substrate for flexible transparent displays, the following conditions must be met: [0003] (1) It has good heat resistance. Inorganic semiconductor devices require higher temperatures during processing. For example, the preparation of carbon nanotube thin film transistors requires more than 200°C, and the processing temperature of indium gallium zinc oxide (IGZO) is above 350°C. Therefore, in order to ensure that the flexible substrate and the electrodes on it have good relative dimensional stability during device processing, the coefficient of thermal expansion (CTE) of the substrate should be below 10ppm / °C t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08C08G73/14
CPCC08G73/1067C08G73/1039C08G73/1042C08G73/1007C08J5/18C08G73/14C08J2379/08
Inventor 朱敏雷霆
Owner PEKING UNIV
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