A preparation method of diamond-reinforced metal matrix composites with high reliability and high thermal conductivity

A diamond-reinforced and composite material technology, which is applied in the field of composite material preparation, can solve the problems of low thermal conductivity of composite materials, interruption of thermal conduction channels, and decreased thermal conductivity, and achieve excellent thermal conductivity, improved reliability, and high reliability.

Active Publication Date: 2021-11-09
HARBIN INST OF TECH
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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the diamond in the existing diamond-reinforced metal matrix composite material is discontinuous, which leads to the interruption of the thermal conduction channel in the composite material, which in turn leads to a decrease in thermal conductivity, the low thermal conductivity of the composite material, and the formation of carbides between diamond and metal leading to reliability. The problem of falling provides a method for the preparation of diamond-reinforced metal matrix composites with high reliability and high thermal conductivity

Method used

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  • A preparation method of diamond-reinforced metal matrix composites with high reliability and high thermal conductivity

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specific Embodiment approach 1

[0022] Specific implementation mode 1: The preparation method of the high-reliability and high-thermal conductivity diamond-reinforced metal matrix composite material in this implementation mode is carried out according to the following steps:

[0023] 1. Weighing: Weigh 50% to 95% of diamond powder and 5% to 50% of metal matrix by volume fraction;

[0024] The surface of the diamond powder has a coating;

[0025] The coating material on the surface of the diamond powder is W, Mo, Cr, Ti, etc., and the coating thickness is 10-50nm; W, Mo, Cr, and Ti are easy to react with diamond at high temperature to form carbides, and the generated carbides The material is stable and does not cause significant changes in thermal conductivity after wet heat treatment.

[0026] 2. Preparation of diamond preform:

[0027] Put the diamond powder into a graphite mold and cold press it to obtain a diamond body; transfer the diamond body with a mold to a spark plasma sintering furnace, and condu...

specific Embodiment approach 2

[0034] Embodiment 2: This embodiment differs from Embodiment 1 in that: the average particle size of the diamond powder in Step 1 is 20-300 μm.

specific Embodiment approach 3

[0035] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the metal substrate in step 1 is pure aluminum, aluminum alloy, pure copper or copper alloy.

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Abstract

A method for preparing a diamond-reinforced metal matrix composite material with high reliability and high thermal conductivity relates to a method for preparing a composite material. The purpose is to solve the problems of low thermal conductivity and reduced reliability of existing diamond-reinforced metal matrix composites. Method: cold-press the coated diamond to obtain a diamond body, conduct spark plasma sintering under the protection of vacuum or an inert atmosphere to obtain a diamond preform, place the diamond preform with a mold on the press table, and pour the molten metal matrix into the Pressure infiltration is performed on top of the diamond preform in the mold. The invention uses spark plasma sintering to sinter the coating on the surface of the diamond to form a continuous heat conduction path, thereby improving the heat conduction performance of the material. The coating is easy to react with diamond to form carbide metal and is stable, which improves the reliability of the prepared composite material. The invention is suitable for preparing diamond-reinforced metal-matrix composite materials.

Description

technical field [0001] The invention relates to a preparation method of a composite material. Background technique [0002] With the rapid development of semiconductor technology, the integration of chips is getting higher and higher, and the heat dissipation is also increasing. At the same time, the performance requirements are extremely high. As we all know, the integration and power density of electronic components are getting higher and higher, and a large amount of heat is generated during the working process of integrated circuits, which will cause the temperature to rise continuously, which will inevitably lead to the decline of chip performance. The advancement of the times is crucial. However, some traditional heat-conducting materials have the problem of low thermal conductivity or high density, which cannot meet the current high heat-conducting and low-quality requirements. Therefore, a new type of heat-conducting material, diamond-reinforced metal matrix compos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10B22F1/02C22C26/00C01B32/28
CPCC22C1/1036C22C1/1015C22C26/00C01B32/28B22F1/17C22C1/1073
Inventor 孙凯张强杨文澍修子扬陈国钦武高辉芶华松姜龙涛康鹏超乔菁周畅
Owner HARBIN INST OF TECH
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