Fixed abrasive polishing pad and dry type polishing method for deliquescent KDP crystals
A fixed abrasive, dry polishing technology, applied in grinding/polishing equipment, abrasives, machine tools for surface polishing, etc., can solve the problems of complex polishing process, low material removal rate, environmental pollution, etc., to simplify the polishing process, The effect of high material removal rate and high abrasive utilization rate
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Embodiment 1
[0033] Use cerium oxide fixed abrasive polishing pad to carry out dry polishing on KDP crystal. The polishing pad contains 30g of cerium oxide abrasive grains with a particle size of 1.0µm; 10g of potassium hydroxide; fatty amide sulfosuccinic acid monoester (N-lauroyl Sodium sarcosinate or fatty alcohol polyoxyethylene ether sodium sulfate) 2.2g, and the remaining components are curing agent and binder; the set polishing pressure is 20kPa; the speed of the polishing pad is 40r / min, and the speed of the workpiece is 45r / min; The time is 20 minutes.
[0034] During the polishing process, the polishing pad is in contact with the KDP crystal surface, and the temperature of the contact surface rises under pressure, and the potassium hydroxide in the polishing pad and the KDP crystal undergo a solid-phase chemical reaction under the catalysis of fatty amide sulfosuccinic acid monoester to form a transition layer, the resulting transition layer is mechanically removed by the cerium ...
Embodiment 2
[0037] The KDP crystal was dry-polished using an alumina-bonded abrasive polishing pad, which contained 25 g of alumina abrasive grains with a particle size of 3.0 µm; 15 g of potassium carbonate; sodium N-lauroyl sarcosinate (fatty amide sulfosuccinate Acid monoester or fatty alcohol polyoxyethylene ether sodium sulfate) 3g, the remaining components are curing agent and binder; the set polishing pressure is 20kPa; the polishing pad speed is 50r / min, the workpiece speed is 55r / min; the polishing time is 25min.
[0038] During the polishing process, the polishing pad is in contact with the KDP crystal surface, and the temperature of the contact surface increases under the action of pressure. The potassium carbonate in the polishing pad and the KDP crystal undergo a solid-phase chemical reaction under the catalysis of N-lauroyl sarcosinate to form a transition layer. , the resulting transition layer is mechanically removed by the alumina abrasive grains in the polishing pad.
...
Embodiment 3
[0041] Use cerium oxide fixed abrasive polishing pad to carry out dry polishing on KDP crystal. The polishing pad contains 35g of cerium oxide abrasive grains with a particle size of 5.0µm; 10g of potassium bicarbonate; fatty amide sulfosuccinic acid monoester (N-lauroyl Sodium sarcosinate or fatty alcohol polyoxyethylene ether sodium sulfate) 4g, the remaining components are curing agent and binder; the set polishing pressure is 25kPa; the polishing pad speed is 40r / min, the workpiece speed is 42r / min; polishing time for 30min.
[0042]During the polishing process, the polishing pad is in contact with the KDP crystal surface, and the temperature of the contact surface rises under pressure, and the potassium bicarbonate in the polishing pad and the KDP crystal undergo a solid-phase chemical reaction under the catalysis of fatty amide sulfosuccinic acid monoester to form a transition layer, the resulting transition layer is mechanically removed by the cerium oxide abrasive grai...
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