Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board substrate comprising a coated boron nitride

A printed circuit, board substrate technology, applied in the field of printed circuit board substrates containing coated boron nitride, can solve the problems of reduced mechanical properties, reduced peel strength, etc.

Pending Publication Date: 2021-05-14
ROGERS CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the addition of such thermally conductive materials has been shown to achieve an increase in the thermal conductivity of various printed circuit board substrates, these filler materials typically suffer from at least one of reduced mechanical properties, reduced peel strength, or long-term problems with thermal aging. By

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board substrate comprising a coated boron nitride
  • Printed circuit board substrate comprising a coated boron nitride
  • Printed circuit board substrate comprising a coated boron nitride

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 6

[0065] Examples 1 to 6: Effect of coating thickness on coated hexagonal boron nitride

[0066]The surface of hexagonal boron nitride particles was coated with aluminum oxide by atomic layer deposition (ALD) using trimethylaluminum and water as precursors. The boron nitride powder used was PBN20, which is a high density agglomerate of hexagonal boron nitride flakes supplied by Zibo Jonye Ceramics Technology Company. PBN20 exhibits a typical median particle size of 18 microns to 22 microns, and 6.2 square meters per gram (m 2 / g) specific surface area. By gradually varying the number of ALD cycles, a series of coated powders with different coating thicknesses were produced. The aluminum content of the coated powders was determined by ICP analysis and the surface energy was measured by the Washburn wicking method for the contact angles of the different probe liquids. The contact angle measurements were combined with Fowkes theory to decompose the surface energy into dispersive...

Embodiment 7

[0070] Example 7: Printed Circuit Board Substrates Comprising Coated Boron Nitride

[0071] A printed circuit board substrate was prepared comprising 15 volume percent coated boron nitride and 85 volume percent RO4000 (commercially available from Rogers Corporation), both based on the total volume of the substrate minus the glass fiber reinforcement. Coated boron nitride was prepared by coating boron nitride powder (Momentive PT-120) with 10 ALD cycles of alumina. The aluminum oxide coating has a thickness of 5 nm. Thermal conductivity and peel strength are shown in Table 2.

Embodiment 8

[0072] Example 8: Printed Circuit Board Substrate Comprising Uncoated Boron Nitride

[0073] A printed circuit board substrate was prepared comprising 15 volume percent uncoated boron nitride and 85 volume percent RO4000 (commercially available from Rogers Corporation). The uncoated boron nitride is Momentive PT-100. Thermal conductivity and peel strength are shown in Table 2.

[0074]

[0075] Table 2 shows that the peel strength of the printed circuit board substrate of Example 7 comprising the coated boron nitride compared to the printed circuit board substrate of Example 8 comprising the same amount of boron nitride but not coated was improved. language has been significantly improved.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Patent Application Serial No. 62 / 740083, filed October 2, 2018. The related application is hereby incorporated by reference in its entirety. Background technique [0003] A printed circuit board substrate, a method for manufacturing the printed circuit board substrate is disclosed herein. [0004] Circuit designs for electronic equipment such as televisions, radios, computers, medical instruments, business machines, communication equipment, etc. have become smaller and thinner. The increased power of such electronic components leads to increased heat generation. Additionally, smaller electronic components are densely packed into ever smaller spaces, leading to stronger heat generation as hot spot temperatures increase. At the same time, temperature sensitive components in electronic equipment may need to be kept within specified operating temperatures to avoid si...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/03
CPCH05K1/0204H05K2201/0209H05K2201/0227H05K1/0373H05K1/0366H05K2201/029C23C16/403C23C16/45525H05K2201/0293
Inventor 金义均布鲁斯·菲茨克里斯托弗·布朗
Owner ROGERS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com