Diamond grinding and polishing integrated machining equipment and machining method thereof

A kind of processing equipment and diamond technology, applied in metal processing equipment, grinding/polishing equipment, grinding workpiece support, etc., can solve the problem of poor flatness and parallelism of the diamond surface, increase the cost and time-consuming of diamond single crystal surface processing, etc. question

Pending Publication Date: 2021-04-20
HUAQIAO UNIVERSITY
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This processing method has been widely used in the crystal surface processing of diamond jewelry, and the polishing efficiency is high, but it has the following disadvantages: First, the surface roughness of the polished diamond crystal can only reach about 100nm, which cannot meet the requirements of diamond materials in semiconductors. Second, a large amount of heat is generated during the mechanical hard polishing process, which causes the surface temperature of the diamond crystal and the metal disk to be too high, which easily causes graphitization of the diamond surface, and a large amount of graphite and diamond debris generated during the grinding process will enter the metal turntable In the middle, it is easy to cause obvious damage to the metal turntable, so the frequency of polishing disc replacement is very high, the polishing effect is poor in repeatability, and the cost of diamond single crystal surface processing is also greatly increased
Among them, microwave plasma etching technology requires special etching equipment, which is expensive and requires further surface treatment after etching to form a non-destructive diamond crystal surface.
Chemical polishing uses chemical components in the polishing liquid to chemically react with the diamond surface to reduce surface roughness, but chemical polishing makes the diamond surface poor in flatness and parallelism and prone to defects such as corrosion pits
[0005] At present, the diamond grinding and polishing processes are two independent systems. The diamond is completed from the blank to the polishing process. error

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diamond grinding and polishing integrated machining equipment and machining method thereof
  • Diamond grinding and polishing integrated machining equipment and machining method thereof
  • Diamond grinding and polishing integrated machining equipment and machining method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Please check Figure 1 to Figure 3 , diamond grinding and polishing integrated processing equipment, including a frame, a base device 1 and a grinding and polishing device 2; The base 11 on the sliding seat is equipped with a clamp 12 capable of clamping the single crystal diamond 3; the grinding and polishing device 2 includes a main shaft arranged along the Z axis, and the inner ring grinding wheel is set on the main shaft 21 and outer ring grinding wheel 22, the outer diameter of the inner ring grinding wheel 21 is smaller than the inner diameter of the outer ring grinding wheel 22, the outer ring grinding wheel 22 surrounds the inner ring grinding wheel 21, and the outer ring grinding wheel 22 is fixed on the main shaft , the inner ring grinding wheel 21 can slide up and down relative to the main shaft along the Z axis and the inner ring grinding wheel 21 and the main shaft are synchronously rotated and connected, and the inner ring grinding wheel 21 and the outer r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses diamond grinding and polishing integrated machining equipment and a machining method thereof. The machining equipment comprises a rack, a base device and a grinding and polishing device. The base device comprises a sliding seat capable of feeding along a Y axis and a base capable of being connected to the sliding seat in a rotating mode around a Z axis, and a clamp capable of clamping diamond is arranged on the base. The grinding and polishing device comprises a main shaft arranged along the Z axis, an inner ring grinding wheel and an outer ring polishing wheel sleeve the main shaft, the outer ring polishing wheel surrounds the inner ring grinding wheel, the main shaft rotates to drive the inner ring grinding wheel and the outer ring polishing wheel to rotate together, and the vertical position relation of the inner ring grinding wheel and the outer ring polishing wheel along the Z axis can be adjusted. The diamond on the clamp is ground and polished through rotation of the inner ring grinding wheel and the outer ring polishing wheel, feeding of the sliding seat and rotation of the base. The diamond grinding and polishing integrated machining equipment and the machining method thereof have the following advantages that diamond grinding and polishing are integrated into one procedure for machining, scratches and damage to the surface of the diamond are small, and the surface quality is uniform.

Description

technical field [0001] The invention relates to the technical field of diamond processing, in particular to a diamond grinding-polishing integrated processing equipment and a processing method thereof. Background technique [0002] Diamond material is the hardest material known in nature and belongs to the category of superhard materials. Because of the superhard characteristics of its material, its surface processing is difficult and the efficiency is low. [0003] The traditional surface processing method of diamond single crystal uses a high-speed metal turntable to perform hard contact mechanical polishing on the diamond polished surface. This processing method has been widely used in the crystal surface processing of diamond jewelry, and the polishing efficiency is high, but it has the following disadvantages: First, the surface roughness of the polished diamond crystal can only reach about 100nm, which cannot meet the requirements of diamond materials in semiconductor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B24B27/00B24B41/02B24B41/06B24B47/20
CPCB24B41/06B24B27/00B24B47/20B24B41/02B24B37/07B24B27/0069B24B27/0076B24B37/04
Inventor 陆静温海浪罗求发李晨艾腾峰
Owner HUAQIAO UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products