Modified resin composition and preparation method and application thereof

A technology of modified resin and composition, which is applied in the field of modified resin composition and its preparation, can solve the problems of limited application, adverse effects of resin material processability and heat resistance, large cracking of the punching edge of prepreg, etc., to achieve Excellent bonding performance, excellent mechanical properties, and low powder shedding rate

Active Publication Date: 2021-04-16
GUANGDONG HINNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most traditional non-flowing prepregs use rubber-toughened modified epoxy resin as the main resin material. Although prepregs with no or little flow can be obtained, the punching edge of the prepreg cracks during the mechanical punching process. Larger, which has adverse effects on the subsequent processability and heat resistance of resin materials, thus limiting its application in the preparation of multifunctional high-end printed circuit boards

Method used

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  • Modified resin composition and preparation method and application thereof
  • Modified resin composition and preparation method and application thereof
  • Modified resin composition and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] 1) According to the number of parts by mass, in a dry four-necked flask equipped with a stirrer and a thermometer, add 0.3 parts of silane coupling agent, 100 parts of matrix resin (epoxy resin) and 3 parts of dimethylformamide, and stir at the same time Raise the temperature to 150° C., then add 0.5 parts of fumed nano-silica under stirring condition, keep the reaction for 2 hours, and cool to obtain nano-silica-modified epoxy resin.

[0088] 2) According to the number of parts by mass, after adding 5 parts of dicyandiamide and 100 parts of dimethylformamide into the batching bottle and fully stirring and dissolving, 10 parts of phenoxy resin, the nanometer dicyandiamide obtained in step 1) were sequentially mixed under stirring conditions. Add silicon oxide modified epoxy and 0.5 part of 2-methylimidazole into the batching bottle, stir evenly to prepare a glue.

[0089] 3) 1078 glass fiber cloth (basis weight 47.5g / m 2 ) placed in the glue solution obtained in step 2...

Embodiment 2

[0091] 1) According to the number of parts by mass, in a dry four-necked flask equipped with a stirrer and a thermometer, add 0.3 parts of silane coupling agent, 100 parts of matrix resin (epoxy resin) and 3 parts of dimethylformamide, and stir at the same time Raise the temperature to 150° C., then add 0.5 parts of fumed nano-silica under stirring condition, keep the reaction for 2 hours, and cool to obtain nano-silica-modified epoxy resin.

[0092]2) According to the number of parts by mass, after adding 5 parts of dicyandiamide and 100 parts of dimethylformamide into the batching bottle and fully stirring and dissolving, 40 parts of phenoxy resin, the nanometer dicyandiamide obtained in step 1) were sequentially mixed under stirring conditions. Add silicon oxide modified epoxy and 0.5 part of 2-methylimidazole into the batching bottle, stir evenly to prepare a glue.

[0093] 3) 1078 glass fiber cloth (basis weight 47.5g / m 2 ) placed in the glue solution obtained in step 2)...

Embodiment 3

[0095] 1) According to the number of parts by mass, in a dry four-necked flask equipped with a stirrer and a thermometer, add 0.3 parts of silane coupling agent, 100 parts of matrix resin (epoxy resin) and 3 parts of dimethylformamide, and stir at the same time Raise the temperature to 150° C., then add 25 parts of fumed nano-silica under stirring condition, keep the reaction for 2 hours, and cool to obtain nano-silica-modified epoxy resin.

[0096] 2) According to the number of parts by mass, after adding 5 parts of dicyandiamide and 100 parts of dimethylformamide into the batching bottle and fully stirring and dissolving, 10 parts of phenoxy resin, the nanometer dicyandiamide obtained in step 1) were sequentially mixed under stirring conditions. Add silicon oxide modified epoxy and 0.5 part of 2-methylimidazole into the batching bottle, stir evenly to prepare a glue.

[0097] 3) 1078 glass fiber cloth (basis weight 47.5g / m 2 ) placed in the glue solution obtained in step 2)...

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PUM

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Abstract

The invention provides a modified resin composition and a preparation method and application thereof. The modified resin composition is prepared from the following raw materials in parts by weight: 65-100 parts of matrix resin, 10-40 parts of phenoxy resin, 0.5-25 parts of nano silicon dioxide, 2-15 parts of a curing agent, 0-2 parts of a curing accelerator and 0-1 part of a coupling agent. The modified resin composition has the advantages of excellent toughness, excellent processability in the mechanical punching treatment process, low powder falling rate, excellent bonding performance and excellent heat resistance, can be used for preparing high-density and multi-performance printed circuit boards (PCB) with high temperature resistance, aging resistance, integrated circuit packaging, high frequency, high speed and the like, and has wide application prospects. Therefore, the development of a high-end integrated circuit is promoted.

Description

technical field [0001] The invention relates to the technical field of composite resins, in particular to a modified resin composition and its preparation method and application. Background technique [0002] With the rapid development of the electronics industry, electronic products are developing in the direction of miniaturization, multi-function and high security, requiring high-density and multi-functional printed circuit boards (PCBs), and at the same time meeting the requirements of three-dimensional installation of electronic products need. Therefore, more and more consideration is given to the use of rigid-flexible technology, that is, the technology of preparing printed circuit boards by bonding rigid circuit boards and flexible circuit boards through adhesive materials. [0003] In recent years, technicians have increasingly considered the use of non-flow adhesive prepreg as a bonding material for bonding rigid PCB boards and flexible PCB boards. No flow prepreg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L71/12C08K3/36C08J5/24C08K7/14H05K3/46
CPCC08L63/00Y02T50/40C08G59/4021C08G59/5073C08G59/686C08G2650/56H05K1/0353H05K1/0366C08J5/249C08J2363/00C08J2471/00C08K3/36C08L71/00C08J5/244C08J2471/02
Inventor 漆小龙黄荣暖张新权布施健明
Owner GUANGDONG HINNO TECH CO LTD
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