A method and device for uniformly thinning a large-scale irregular busbar-shaped surface shell
A processing method and processing device technology, applied in the field of uniform thinning processing method and device for large irregular busbar-shaped shells, can solve the problems of poor chemical milling precision, large environmental pollution, long production cycle, etc., and achieve uniform thinning Processing, meeting weight and precision requirements, and realizing the effect of precision compensation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0045] The specific embodiments of the present invention are described below to facilitate those skilled in the art to understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments. For those skilled in the art, as long as various changes Such changes are obvious within the spirit and scope of the present invention as defined and determined by the appended claims, and all inventions and creations utilizing the inventive concept are within the scope of protection.
[0046] The object of the present invention is a new type of aluminum alloy sheet, the inner profile is supported by an ellipsoid mold tire, and the outer profile is supported by a tail top pressure tool, and the parts to be processed that are consistent with the ellipsoid surface of the inner profile are formed by spinning. Thin machining provides blanks.
[0047] After the shell blank is formed, subject to the uneven distribution of the a...
PUM
Property | Measurement | Unit |
---|---|---|
diameter | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com