A functionalized boron nitride nanosheet/mxene/polybenzimidazole composite film with high thermal conductivity and preparation method

A composite film and benzimidazole technology, applied in the field of composite materials, can solve the problems of insufficient thermal conductivity and other problems, and achieve the effects of simple method, excellent thermal conductivity and wide application prospects

Active Publication Date: 2022-08-05
SHANGHAI UNIVERSITY OF ELECTRIC POWER
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention is carried out to solve the problem that the thermal conductivity of the above-mentioned single mixed filler filling polymer is not obvious enough, and the purpose is to provide a high thermal conductivity functionalized boron nitride nanosheet / MXene / polybenzimidazole high thermal conductivity composite The thin film and its preparation method adopt 2D mixed filler bridging synergy to better form a good mixed filler-polymer interface, reduce interfacial thermal resistance, build a good heat conduction path, and promote heat transfer

Method used

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  • A functionalized boron nitride nanosheet/mxene/polybenzimidazole composite film with high thermal conductivity and preparation method
  • A functionalized boron nitride nanosheet/mxene/polybenzimidazole composite film with high thermal conductivity and preparation method
  • A functionalized boron nitride nanosheet/mxene/polybenzimidazole composite film with high thermal conductivity and preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0038] A preparation method of a composite film containing 1wt% boron nitride nanosheet / MXene mixed filler, the specific steps are as follows:

[0039] (1) The boron nitride powder was calcined under nitrogen gas in a tube furnace at 1000°C for 3h.

[0040] (2) Take 1 g of calcined boron nitride powder and 5 g of urea and put them in a round-bottomed flask, under nitrogen gas, and heated to 140° C. in an oil bath for melting reaction for 6 hours.

[0041] (3) After the reaction is completed, the solid is dispersed in 500ml of deionized water, and ultrasonically stripped for 10h to obtain a dispersion, and then the dispersion is centrifuged at 3000rpm for 10min to obtain a supernatant; the supernatant is filtered and deionized water is used. The filter cake is washed, wherein the filtering method is preferably suction filtration, and the collected solids are dried at 60° C. for 10 h to obtain urea-functionalized boron nitride nanosheets.

[0042] (4) Put 1g of Ti 3 AlC 2 Gra...

Embodiment 2

[0046] A preparation method of a composite film containing 5wt% boron nitride nanosheet / MXene mixed filler, the specific steps are as follows:

[0047] (1) The boron nitride powder was calcined under nitrogen gas in a tube furnace at 1000°C for 3h.

[0048] (2) Take 1 g of calcined boron nitride powder and 5 g of urea and put them in a round-bottomed flask, under nitrogen gas, and heated to 140° C. in an oil bath for melting reaction for 6 hours.

[0049] (3) After the reaction is completed, the solid is dispersed in 500ml of deionized water, and ultrasonically stripped for 10h to obtain a dispersion, and then the dispersion is centrifuged at 3000rpm for 10min to obtain a supernatant; the supernatant is filtered and deionized water is used. Washing, wherein the filtration method is preferably suction filtration, and the collected solids are dried at 60° C. for 10 h to obtain urea-functionalized boron nitride nanosheets.

[0050] (4) Put 1g of Ti 3 AlC 2 Gradually and slowly...

Embodiment 3

[0054] A preparation method of a composite film containing 10wt% boron nitride nanosheet / MXene mixed filler, the specific steps are as follows:

[0055] (1) The boron nitride powder was calcined under nitrogen gas in a tube furnace at 1000°C for 3h.

[0056] (2) Take 1 g of calcined boron nitride powder and 5 g of urea and put them in a round-bottomed flask, under nitrogen gas, and heated to 140° C. in an oil bath for melting reaction for 6 hours.

[0057] (3) After the reaction is completed, the solid is dispersed in 500ml of deionized water, and ultrasonically stripped for 10h to obtain a dispersion, and then the dispersion is centrifuged at 3000rpm for 10min to obtain a supernatant; the supernatant is filtered and deionized water is used. Washing, wherein the filtration method is preferably suction filtration, and the collected solids are dried at 60° C. for 10 h to obtain urea-functionalized boron nitride nanosheets.

[0058] (4) Put 1g of Ti 3 AlC 2 Gradually and slowl...

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Abstract

The invention belongs to the technical field of composite materials, and provides a functionalized boron nitride nanosheet / MXene / polybenzimidazole high thermal conductivity composite film and a preparation method. Disperse in a dispersant, mix to obtain a mixed solution, then add polybenzimidazole to the mixed solution to obtain a functionalized boron nitride nanosheet / MXene / polybenzimidazole blend, and filter the blend to obtain a composite film . The invention utilizes the three-dimensional structure of the polybenzimidazole polymer to make the modified boron nitride and the MXene with electronegativity undergo electrostatic self-assembly to form the polybenzimidazole as the skeleton, the functionalized boron nitride nanosheets and the MXene as the Self-supporting films of mixed fillers. Boron nitride nanosheets and Ti 3 C 2 The filled network formed by the synergistic effect of Tx bridging effectively reduces the interfacial thermal resistance and endows the composite film with excellent thermal conductivity. The method is simple and effective, and the prepared high thermal conductivity film has wide application prospects in the fields of energy, electronics and the like.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a functionalized boron nitride nanosheet / MXene / polybenzimidazole high thermal conductivity composite film and a preparation method. Background technique [0002] With the rapid development of science and technology, electronic components and their equipment are gradually becoming integrated, miniaturized and light-weight. The concentration of large amounts of heat can have a detrimental effect on the safety and longevity of electronic components. Therefore, in order to ensure that the heat generated by the heat-generating electronic components is discharged in time and the electronic equipment can operate safely and stably for a long time, heat dissipation has become an urgent problem to be solved at present. [0003] Boron nitride has become a widely used thermally conductive hybrid filler due to its ultra-high thermal conductivity, good insulation and mechanical pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/04C08K3/38C08K7/00C08K3/14C08K9/04C08K9/02C08J5/18
CPCC08J5/18C08J2379/04C08K2201/011C08K2003/385C08K7/00C08K3/14C08K9/04C08K9/02
Inventor 范金辰莫瑞闵宇霖时鹏辉徐群杰秦习高晨淇
Owner SHANGHAI UNIVERSITY OF ELECTRIC POWER
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