LED nitrogen sealing bonding wire device capable of avoiding welding oxidation

Abstract

The invention relates to the technical field of semiconductor lighting device manufacturing, and discloses an LED nitrogen sealing bonding wire device capable of avoiding welding oxidation. The devicecomprises a sealing shell. The left side of the sealing shell is provided with an air inlet pipeline, the right side of the sealing shell is provided with an air outlet pipeline, and a valve mechanism is arranged above the air inlet pipeline. A workpiece table is fixedly connected to the bottom end of the interior of the sealing shell, a positioning base is arranged at the top of the workpiece table, and a first contact is arranged at the top of the positioning base. According to the LED nitrogen sealing welding wire device capable of avoiding welding oxidation, through cooperative use of thevalve mechanism and a top plate, it can be guaranteed that air in the sealing shell is exhausted before welding is conducted, then the sealing shell is filled with nitrogen, and automatic welding iscarried out in an oxygen-free environment, so that the working efficiency is improved, device oxidation caused by improper nitrogen protection due to manual welding is avoided, the production cost isreduced to a certain extent, and energy waste is avoided.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor lighting devices, in particular to an LED nitrogen-sealed wire bonding device that avoids soldering oxidation. Background technique [0002] Semiconductor lighting is an emerging lighting technology. Its basic device is a light-emitting diode, which is a semiconductor solid light-emitting device. Semiconductor lighting has remarkable features such as high efficiency, energy saving, environmental protection, and easy maintenance. It is an effective way to achieve energy saving and emission reduction. It has gradually become another revolution in lighting sources after incandescent lamps and fluorescent lamps in the history of lighting. However, the raw materials and procedures for making semiconductor lighting devices are extremely complicated. One of the procedures is the wire bonding process. Palladium-plated wires and copper wires need to be welded under nitrogen protection t...

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an LED nitrogen-sealed wire welding device that avoids welding oxidation, which has the advantages of automatic welding and guarantees that there is always nitrogen protection during the welding process, and solves the problem of manual welding that reduces work efficiency and cannot guarantee Nitrogen protection causes energy waste and increases production costs

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