High-thermal-conductivity and high-electric-conductivity PC/ABS composite material and preparation method thereof

Abstract

The invention relates to a high-thermal-conductivity and high-electric-conductivity PC / ABS composite material and a preparation method thereof. The high-heat-conductivity and high-electric-conductivity PC / ABS comprises PC, ABS, a toughening agent, a graphite heat-conducting filler, a cellulose heat-conducting filler, a coupling agent, a main antioxidant, an auxiliary antioxidant and a lubricatingagent, wherein the graphite heat-conducting filler and the fiber heat-conducting filler are respectively subjected to polyvinyl alcohol coating modification and coupling agent modification treatment in advance; and blending, melting and extruding are carried out to obtain heat-conducting filler master batch, and the heat-conducting filler master batch is compounded with other raw material components. According to the high-heat-conductivity and high-electric-conductivity PC / ABS composite material, a multi-heat-conductivity and multi-electric-conductivity percolation network is constructed by compounding the graphite heat-conducting filler and the fiber heat-conducting filler, and the graphite heat-conducting filler and the fiber heat-conducting filler are subjected to surface chemical modification in combination with pretreatment of polyvinyl alcohol coating and coupling agent treatment; The electric conduction and heat conduction performance is effectively improved, and the impact resistance of the material can be enhanced.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high thermal conductivity and electrical conductivity PC / ABS composite material and a preparation method thereof. Background technique [0002] PC / ABS composite material inherits the high heat resistance, high impact and high dimensional stability of PC and the high flow and low internal stress of ABS. It is a kind of composite material with excellent comprehensive properties. It has a wide range of applications in the fields of automobile, machinery, and communication. The service life and failure of many electronic devices are directly related to heat dissipation. As the size of electronic devices is further reduced and the integration level is improved, higher requirements for heat dissipation are also put forward. In addition, in order to prevent surface charge accumulation The resulting series of problems, some products also have electrical conductivity requirem...

AI Technical Summary

Problems solved by technology

[0003] Adding carbon materials or metal powders with excellent thermal and electrical conductivity is an effective way to improve the thermal and electrical conductivity of plastic materials, but only by blending and melting granulation can the thermal and electrical conductivity of plastic materials be improved. Limited, it is difficult to meet the needs of high-end products

As a common technical problem in the field of thermally conductive plastic materials, when inorganic thermally conductive fillers and plastic materials are blended, due to the poor compatibility of the two, it is difficult to disperse the thermally conductive fillers evenly in the plastic matrix, and it is easy to agglomerate when the added amount is high, so it is difficult Form an efficient heat conduction network, and at the same time, poor compatibility also leads to strong heat dissipation of phonons at the interface, which also makes it difficult to greatly increase the thermal conductivity of the material system

In addition, in the feeding hopper of the extruder, heat-conducting fillers such as graphite and carbon nanotubes with low bulk density and plastic particles with high bulk density are prone to stratification, which is prone to the problem of uneven feeding during the melt extrusion process

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