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Waterproof polyamide-based adhesive and preparation method thereof

A polyamide-based, adhesive technology, applied in the direction of adhesives, polyurea/polyurethane adhesives, adhesive types, etc., can solve the problems of unsatisfactory water resistance and high cost of formaldehyde-free adhesives, and achieve good emulsification and dispersion effect of effect

Active Publication Date: 2021-02-05
NORTHEAST FORESTRY UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problems of high cost and unsatisfactory water resistance of the formaldehyde-free adhesive for wood-based panels, and provide a waterproof grade polyamide-based adhesive and its preparation method

Method used

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  • Waterproof polyamide-based adhesive and preparation method thereof
  • Waterproof polyamide-based adhesive and preparation method thereof
  • Waterproof polyamide-based adhesive and preparation method thereof

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specific Embodiment approach 1

[0032] Embodiment 1: The waterproof grade polyamide-based adhesive of this embodiment consists of 100 parts by weight of polyamide-based water-based cross-linking dispersant, 20-275 parts of water, and 5-45 parts of polymethylene polyphenyl polyisocyanate PMDI And 10 to 185 parts of inorganic fillers, stirred evenly at room temperature.

specific Embodiment approach 2

[0033] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the inorganic filler is one of kaolin, talcum powder, calcium carbonate, montmorillonite, bentonite and attapulgite powder with a particle size of 800-5000 mesh Or a mixture composed of any ratio. Others are the same as the first embodiment.

specific Embodiment approach 3

[0034] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the amount of polymethylene polyphenyl polyisocyanate PMDI is 5% to 20% of the weight of the polyamide-based water-based crosslinking dispersant. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a waterproof polyamide-based adhesive and a preparation method thereof, and relates to an adhesive and a preparation method thereof. The invention aims to solve the technical problems of high cost and non-ideal water resistance of the formaldehyde-free adhesive for an artificial board. A method for preparing a dispersing agent comprises the following steps: stirring and heating adipic acid or an adipic acid / organic binary anhydride mixture and a polyamine compound, adding water, adding epoxy chloropropane, heating, and reacting to obtain the dispersing agent. The adhesive is prepared by uniformly stirring a polyamide-based aqueous cross-linking dispersant, water, polymethylene polyphenyl polyisocyanate (PMDI) and an inorganic filler at room temperature in parts by weight. According to the polyamide-based water-based polymer composite adhesive, the PMDI dosage can be reduced by 33%, the adhesive cost is reduced, the working life is long, and formaldehyde and an organic solvent are not used in the preparation process. The product can effectively solve the problem of high cost of the existing formaldehyde-free soybean adhesive for artificial boards, and has theadvantages of excellent boiling water resistance and environment friendliness. The invention belongs to the technical field of adhesives.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to a waterproof-grade aldehyde-free water-based polymer composite adhesive for wood-based panels. Background technique [0002] As the largest country in wood-based panel production, consumption and import and export trade, China's wood-based panel production in 2019 was about 309 million cubic meters, of which plywood output reached 180 million cubic meters and blockboard 18 million cubic meters. However, my country's wood-based panel production is still mainly based on urea-formaldehyde resin adhesives and melamine-modified urea-formaldehyde resin adhesives, which account for more than 90% of wood-based panel adhesives. Urea-formaldehyde resin adhesive is a synthetic resin adhesive synthesized with urea and formaldehyde as the main raw materials. It has excellent bonding performance, process performance and low cost, but it will release free formaldehyde during produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/04C09J11/06B27D1/04
CPCC09J175/04C09J11/04C09J11/06B27D1/04C08K2201/005C08K3/346
Inventor 高振华范铂孙宗兴白玉梅
Owner NORTHEAST FORESTRY UNIVERSITY
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