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Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive

A technology of insulating paper and adhesives, applied in the direction of adhesives, adhesive types, epoxy resin glue, etc., can solve the problems of transformers, motors, electrical products, hidden dangers in quality, difficulty in meeting the requirements of transformers, and decrease in bonding strength. , to achieve excellent cohesiveness and storage, large market application value, and improved cohesive strength

Active Publication Date: 2021-02-02
西安西电电工材料有限责任公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the bonding strength of phenolic resin type dispensing paper is lower than that of epoxy resin dispensing paper, it was widely used as a mainstream product when the transformer capacity was small and the motor voltage level was low. With the increase of transformer capacity, With the improvement of motor voltage level and the development of motor and electrical products in the direction of high voltage, long life and high reliability, the safety requirements for motor and electrical products are also getting higher and higher, and the requirements for the adhesive strength as an important performance of dispensing paper It is also getting higher and higher. Due to the lower bond strength, it is more and more difficult to meet the use requirements of transformers or electrical appliances, and the phenolic resin type dispensing paper is gradually eliminated by the market.
[0005] In order to meet the higher requirements for the adhesive strength of dispensing paper after the increase of transformer capacity and the increase of motor voltage, and the higher requirements for the adhesive strength of dispensing paper in the direction of high voltage, long life and high reliability of motor and electrical products, Most manufacturers of dispensing paper now use epoxy resin as the adhesive for producing dispensing paper, but the bond strength value of the produced dispensing paper products is generally limited compared with the standard value, especially with the storage time Disadvantages of prolonged bond strength value drop
Especially when it comes to the storage period, the bond strength drops significantly, which brings great quality hidden dangers to the production of transformers, motors, and electrical products

Method used

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  • Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive
  • Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive
  • Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive

Examples

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Effect test

preparation example Construction

[0027] A method for preparing an adhesive for rhombic dispensing insulating paper, specifically:

[0028] First start stirring, add a solvent with a mass percentage of 6.2%-7.1% into the reaction kettle, slowly add 2.5%-3.1% curing agent A, stir for 5 minutes, slowly add 8.0%-9.0% epoxy resin A, stir After 10 minutes, turn on the steam to raise the temperature, and turn off the steam when the mixture is heated to 110°C within 20-60 minutes. Under the reflux state, keep the temperature at 110°C-130°C for about 60-90 minutes and then start sampling to measure the molding time. (160±2°C, knife method, 2 grams of sample), if the molding time reaches 9 minutes to 14 minutes (160±2°C, knife method), then turn off the steam and cool down to below 100°C and slowly add a mass percentage of 20%-23 % epoxy resin B, then keep warm at 90-100°C for 30 minutes, after the glue becomes clear, release the vacuum, turn off the steam and cool down to below 60°C, slowly add 11.2%-13% epoxy resin C...

Embodiment 1

[0037] First start stirring, add mass percentage in reaction kettle and be 6.2% xylene, slowly add 2.5% curing agent DDM, slowly add 8.0% E51 epoxy resin after stirring for 5 minutes, turn on steam and heat up after stirring for 10 minutes, When the temperature of the mixed material is raised to 110°C within 20 minutes, close the steam inlet valve, and in the reflux state, keep the temperature at 130°C for about 60 minutes and then start sampling to measure the molding time (160±2°C, knife method, 2 grams of sample), molding The time is 11 minutes, and if the process requirements are met, close the steam inlet valve, lower the temperature of the material below 100°C and slowly add 23% E12 epoxy resin by mass percentage, and then properly open the steam inlet valve to keep the material at 100°C for 30 minutes After the glue solution becomes clear, close the steam inlet valve, cool down to below 60°C and slowly add 11.2% F53 epoxy resin by mass percentage, 1.1% modified amine lat...

Embodiment 2

[0039] First start stirring, add 7.1% solvent butanol in the reaction kettle, slowly add 3.1% curing agent m-phenylenediamine, stir for 5 minutes, slowly add 9.0% EF180 epoxy resin A, stir for 10 minutes Turn on the steam to raise the temperature, raise the temperature of the mixture to 110°C within 60 minutes, then close the steam inlet valve, and in the reflux state, keep the temperature at 120°C for about 60 minutes and start sampling to measure the molding time (160±2°C, knife method, 2 grams of sample), the molding time is 11 minutes, to meet the process requirements, then close the steam inlet valve, make the temperature of the material drop below 100 ℃ and slowly add 20% E20 epoxy resin by mass percentage, then properly open the steam inlet valve to make the material in Keep warm at 90°C for 30 minutes. After the glue becomes clear, close the steam inlet valve, cool down to below 60°C and slowly add 13% F51 epoxy resin and 1.6% boron trifluoride ethylamine complex Curin...

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Abstract

The invention discloses an adhesive for diamond-grid dispensing insulation paper and a preparation method of the adhesive, and the adhesive comprises the following raw materials in percentage by mass:6.2%-7.1% of a solvent, 2.5%-3.1% of a curing agent A, 8.0%-9.0% of epoxy resin A, 20%-23% of epoxy resin B, 11.2%-13% of epoxy resin C, 1.1%-1.6% of a curing agent B and 44%-48% of acetone, whereinthe curing agent A is DDM, DDS or m-phenylenediamine; the curing agent B is dicyandiamide, a modified amine latent curing agent or a boron trifluoride ethylamine complex; the epoxy resin A is E44 epoxy resin, E51 epoxy resin or EF180 epoxy resin; the epoxy resin B is o-cresol formaldehyde epoxy resin, E20 epoxy resin or E12 epoxy resin; and the epoxy resin C is F44 novolac epoxy resin, F51 novolacepoxy resin or F53 novolac epoxy resin. Dispensing paper produced by adopting the adhesive prepared by the invention has the characteristics of high bonding strength and good storage performance, andhas good application prospect and economic benefit.

Description

technical field [0001] The invention belongs to the field of rhombic dispensing insulating paper, and in particular relates to an adhesive for rhombic dispensing insulating paper and a preparation method thereof. Background technique [0002] Lingge dispensing insulating paper is widely used in interlayer insulation and interturn insulation of oil-immersed power transformers. When in use, the coating layer begins to melt at a certain temperature during the coil drying process, resulting in adhesion. It rises and starts to solidify again, so that the adjacent layers of the winding are reliably bonded into a fixed unit. Due to the bonding of epoxy resin, the displacement of each layer of the winding during short circuit can be prevented, thereby ensuring the electrical and mechanical properties of the insulation structure. Because the resin coating of the rhombic dispensing paper is in the form of dots, it ensures the immersion of oil and the removal of gas in the insulating m...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04
CPCC09J163/00C09J163/04C08L2205/025C08L2205/03C08L63/00C08L63/04
Inventor 杜超云王战强贺旭芝
Owner 西安西电电工材料有限责任公司
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