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Halogen-free phosphorus-containing low-dielectric copper-clad plate and preparation method thereof

A copper-clad laminate and low-dielectric technology, which is applied in the field of electronic materials and its preparation, can solve problems such as polluting the environment and endangering human health, achieve low corrosion resistance, improve the overall safety factor, and improve heat resistance and flame resistance. Effect

Pending Publication Date: 2021-01-22
江苏联鑫电子工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For now, in order to improve the flame retardancy coefficient of circuit boards and reduce production costs in the production of many circuit boards in the prior art, bromine compounds will still be contained in them; moreover, halides will release a large amount of corrosive harmful substances during combustion. Gas, not only pollutes the environment, but also endangers human health

Method used

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  • Halogen-free phosphorus-containing low-dielectric copper-clad plate and preparation method thereof
  • Halogen-free phosphorus-containing low-dielectric copper-clad plate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment

[0031] Embodiment: A halogen-free phosphorus-containing low-dielectric copper-clad laminate includes two layers of copper foil layers and an insulating dielectric layer located between the two layers of copper foil layers, wherein the insulating dielectric layer is composed of at least one prepreg; Each prepreg is obtained by immersing glass fiber cloth in resin glue and then drying; the resin glue includes the following components in parts by weight: 140-170 parts of phosphorus-containing epoxy resin, 14- 17 parts of cyanate ester resin, 3-6 parts of curing agent, 0.03-0.07 parts of curing agent accelerator, 40-80 parts of solvent, 27-30 parts of o-cresol type epoxy resin and 40-70 parts of inorganic filler.

[0032] Specifically, the phosphorus-containing epoxy resin is a DOPO-type modified phosphorus-containing epoxy resin with a phosphorus mass fraction of 2wt.%-4wt.%. The resin is a modified phosphorus-based epoxy resin with multiple modified functional groups. The copper...

specific Embodiment 1

[0040] A halogen-free phosphorus-containing low-dielectric copper clad laminate, comprising two layers of copper foil and an insulating dielectric layer between the two layers of copper foil, wherein the insulating dielectric layer is composed of 6 prepregs; each prepreg It is obtained by impregnating glass fiber cloth in resin glue solution and then drying. Its preparation process is as follows:

[0041] S1, preparation of resin glue: take by weight, 140 parts of phosphorus-containing epoxy resin, 17 parts of cyanate resin, 4 parts of curing agent, 0.04 part of curing agent accelerator, 50 parts of solvent, 27 parts of o-cresol Add type epoxy resin and 50 parts of inorganic filler into the mixer, stir at 30°C for 4 hours to obtain resin glue;

[0042] S2, preparation of glass fiber cloth impregnated material: apply the resin glue prepared in step S1 on both sides of the glass fiber cloth by dipping, and dry at 200°C for 3 minutes to prepare the glass fiber cloth Dip sheet; ...

specific Embodiment 2

[0050] A halogen-free phosphorus-containing low-dielectric copper clad laminate, comprising two layers of copper foil and an insulating dielectric layer between the two layers of copper foil, wherein the insulating dielectric layer is composed of 6 prepregs; each prepreg It is obtained by impregnating glass fiber cloth in resin glue solution and then drying. Its preparation process is as follows:

[0051] S1, preparation of resin glue: take by weight, 150 parts of phosphorus-containing epoxy resin, 15 parts of cyanate resin, 5 parts of curing agent, 0.05 part of curing agent accelerator, 60 parts of solvent, 28 parts of o-cresol Type epoxy resin and 40 parts of inorganic fillers were added to the mixer, and stirred at 32°C for 4.2 hours to obtain resin glue;

[0052] S2, preparation of glass fiber cloth impregnated material: apply the resin glue prepared in step S1 on both sides of the glass fiber cloth by dipping, and dry at 200°C for 2 minutes to prepare the glass fiber cloth...

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Abstract

The invention discloses a halogen-free phosphorus-containing low-dielectric copper-clad plate and a preparation method thereof, and belongs to the technical field of electronic materials and preparation thereof. According to the invention, by selecting the components and proportion of the resin glue solution and selecting the glass fiber cloth, the copper-clad plate has excellent properties such as high heat resistance, high flame resistance, low dielectric constant, low dielectric loss and the like, so that the overall safety coefficient of the product is greatly improved, and the troubles and hidden dangers caused by poor electrical insulativity in the PCB processing process are avoided; meanwhile, the requirements of the halogen-free process of high-order products can be comprehensivelymet in the aspects of halogen-free flame retardance, expansion coefficient, CAF resistance, corrosion resistance and the like, and the halogen-free process can be completely suitable for the halogen-free process of high-order multilayer boards with 20 layers or even more than 30 layers. According to the invention, the issues in the aspects of practical application and processing of downstream PCBs are researched in a targeted mode, performance balance is fully considered, and performance application of the board in the aspects is brought into full play to the best.

Description

technical field [0001] The invention relates to a copper-clad laminate and a preparation method thereof, in particular to a halogen-free phosphorus-containing low-dielectric copper-clad laminate and a preparation method thereof, belonging to the technical field of electronic materials and preparation thereof. Background technique [0002] Copper Clad Laminate (CCL) is the main material for the manufacture of printed circuit boards (PCBs), so it is also an indispensable basic electronic material for any electronic product and its components. Today, when the halogen-free era is developing in an all-round way and becoming more and more mature, the European Union and mainland China have promulgated and implemented the directive ROHS on the Restriction of Hazardous Substances, clearly stating that mercury, lead, cadmium and other substances cannot be used in the production of electronic products; at the same time, Greenpeace has also begun to vigorously The implementation of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/14B32B15/20B32B17/02B32B17/06B32B37/06B32B37/10B32B38/16B32B38/08C08J5/24C08L63/00C08L79/04C08K13/04C08K7/14C08K3/22C08K3/36C08K3/30
CPCB32B5/02B32B15/14B32B15/20B32B17/061B32B38/08B32B38/164B32B37/06B32B37/10C08J5/24B32B2260/021B32B2260/046B32B2307/306B32B2307/3065B32B2307/714B32B2307/204B32B2457/08C08J2363/00C08J2479/04C08J2463/00C08K13/04C08K7/14C08K2003/2227C08K3/36C08K2003/3045
Inventor 陆波
Owner 江苏联鑫电子工业有限公司
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