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Composite solder preformed sheet as well as preparation method and packaging method thereof

A technology of preformed sheet and composite welding, which is applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc. It can solve the problems of fast interface diffusion rate and interface performance degradation, achieve rapid preparation, improve compatibility, and inhibit The effect of substrate element diffusion

Pending Publication Date: 2021-01-08
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For substrates metallized on the surface of copper and gold, nano-silver sintering has the problems of fast interfacial diffusion rate and degradation of interfacial properties.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A composite solder preform, which is prepared by the following steps:

[0033] (1) Silver paste was obtained by mixing micron silver flakes and organic vehicle, wherein the silver solid content was 60wt%; the silver paste was printed and baked at 180°C to obtain a pre-sintered silver film with a thickness of 80 μm.

[0034] (2) The tin-silver-copper solder was deposited on one side of the silver film by the cold spray method, and the deposition thickness was 20 μm to obtain a composite solder preform.

[0035] The composite solder preform prepared above is used to carry out packaging test, including the following steps:

[0036] (1) Place the composite solder preform on the copper substrate, where the side where the tin-silver-copper solder is deposited is in contact with the copper interface, and attach the chip surface to the preform at a temperature of 120°C, a pressure of 1MPa, and a time of 30s .

[0037] (2) The stacked structure of the chip, the preformed sheet...

Embodiment 2

[0040] A composite solder preform, which is prepared by the following steps:

[0041] (1) Silver paste was obtained by mixing spherical silver powder and organic vehicle, wherein the silver solid content was 70wt%; the silver paste was printed and baked at 150°C to obtain a pre-sintered silver film with a thickness of 100 μm.

[0042] (2) The tin-silver-copper solder was deposited on one side of the silver film by the cold spray method, and the deposition thickness was 10 μm to obtain a composite solder preform.

[0043] The composite solder preform prepared above is used to carry out packaging test, including the following steps:

[0044] (1) Place the composite solder preform on the nickel substrate, where the side where the tin-silver-copper solder is deposited is in contact with the nickel interface, and attach the chip surface to the preform at a temperature of 100°C, a pressure of 2MPa, and a time of 20s .

[0045] (2) Hot-press sinter the stacked structure of the chip...

Embodiment 3

[0048] A composite solder preform, which is prepared by the following steps:

[0049] (1) Silver paste was obtained by mixing flake silver powder and organic vehicle, wherein the silver solid content was 50wt%; the silver paste was printed and baked at 200°C to obtain a pre-sintered silver film with a thickness of 200 μm.

[0050] (2) Use the cold spray method to deposit glass frit on one side of the silver film, and the glass frit is ZnO, BaO, Bi 2 o 3 , B 2 o 3 The glassy powder formed by quenching after high-temperature melting is deposited with a thickness of 50 μm to obtain a composite solder preform.

[0051] The composite solder preform prepared above is used to carry out packaging test, including the following steps:

[0052] (1) Place the composite solder preform on the alumina substrate, where the side of the deposited glass frit is in contact with the alumina interface, and attach the chip surface to the preform at a temperature of 150°C and a pressure of 0.1MPa...

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Abstract

The invention provides a composite solder preformed sheet as well as a preparation method and a packaging method thereof. The composite solder preformed sheet comprises a substrate; the substrate is apre-sintered silver film; one side or two sides of the substrate is / are provided with a solder layer / solder layers; and solder of the solder layers is low-temperature tin-based solder or high-temperature frit. With adoption of the technical scheme, the composite solder preformed sheet can effectively improve the compatibility of sintered silver and a heterogeneous substrate interface, connectionbetween the sintered silver solder and different metal substrates or ceramic substrates is achieved, in addition, an intermetallic compound or a glassy barrier layer can be generated through the interface, substrate element diffusion is inhibited, the reliability of the sintering welding spot is enhanced, the interface connection performance of the sintered silver material and different metal or ceramic interfaces is improved, and rapid preparation of the low-temperature interconnection high-temperature service welding spot can be achieved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a composite solder preform, a preparation method thereof, and a packaging method. Background technique [0002] At present, power semiconductor devices are widely used in the field of power electronics, which can realize functions such as power conversion and signal control of power equipment. Power semiconductor chips generate a lot of heat due to their high frequency and high current density in service. In order to ensure the reliable operation of the chip, it is necessary to dissipate the heat through the connection material with high heat dissipation. In addition, in order to reduce the thermal stress after soldering and improve device reliability, low-temperature connection is also one of the demands of chip packaging. [0003] Nano-silver solder, such as nano-silver paste and nano-silver film, is currently the most promising interconnect material ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26B23K35/36B23K35/40H01L21/56
CPCB23K35/22B23K35/262B23K35/36B23K35/3601B23K35/40H01L21/56
Inventor 李明雨杨帆祝温泊胡博
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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