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A kind of FCCL flexible copper clad laminate and its manufacturing method

A technology of flexible copper clad laminates and manufacturing methods, which is applied in the direction of printed circuit manufacturing, manufacturing printed circuit precursors, circuit substrate materials, etc., can solve the problems of application limitations, poor performance of thermoplastic polyimide, etc., and achieve simple process and high efficiency High and efficient effect

Active Publication Date: 2021-10-26
江苏百旭电子新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this process has the same defects as the first process above, because the performance of thermoplastic polyimide is not as good as that of biaxially stretched thermosetting polyimide
This kind of product eliminates the defect of the glue of the glued composite flexible copper clad laminate, but it also has big shortcomings, so the application is also limited.

Method used

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  • A kind of FCCL flexible copper clad laminate and its manufacturing method
  • A kind of FCCL flexible copper clad laminate and its manufacturing method
  • A kind of FCCL flexible copper clad laminate and its manufacturing method

Examples

Experimental program
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Effect test

Embodiment 1）

[0028] See figure 1 and figure 2 , a FCCL flexible copper clad laminate in this embodiment includes a substrate layer 1 and a metal layer deposited on one or both sides of the substrate layer 1 by a metal cold spraying process, that is, a cold sprayed metal deposition layer 2 . in figure 1 The above is a single-sided FCCL flexible copper clad laminate, figure 2 Double sided FCCL flexible copper clad laminate shown.

[0029] The substrate layer 1 adopts a thermosetting biaxially oriented polyimide film with a thickness of 10um-100um as the substrate, and generally has several specifications of 12um, 25um, 38um, 50um, 62.5um, 75um or 100um.

[0030] The thickness of the cold-sprayed metal deposition layer 2 is greater than 1 um, up to millimeter or centimeter level, but generally between 10 um and 200 um as required by the industry.

Embodiment 2）

[0032] See image 3 , the manufacturing method of the FCCL flexible copper-clad laminate that obtains by embodiment 1 comprises the steps:

[0033] ① Select a thermosetting biaxially oriented polyimide film material with a thickness of 10um-100um as the substrate layer 1, and generally use several specifications of 12um, 25um, 38um, 50um, 62.5um, 75um or 100um;

[0034] ②Before carrying out the metal cold spraying treatment on the substrate layer 1, the metal powder to be cold sprayed needs to be treated: the cold sprayed metal raw materials suitable for the present invention are relatively soft metals, including silver, copper, nickel or gold, etc. The particle size is between 1-100um, preferably 3-40um, and the metal is generally pure copper; before the metal cold spraying treatment is performed on the base material layer 1, the metal powder to be cold sprayed needs to be treated so that it can be successfully sprayed. Applicable to the implementation of the present inventi...

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Abstract

The invention relates to an FCCL flexible copper clad laminate, comprising a base material layer and a layer of metal layer deposited on one side or both sides of the base material layer by a metal cold spray process, namely a cold spray metal deposition layer; the manufacturing method thereof includes the following steps: Steps: ①Select a thermosetting biaxially oriented polyimide film material as the substrate layer; ②Process the metal powder to be cold sprayed: Step 1, anneal the spherical metal powder; Step 2, anneal the metal powder And the plastic whose heat shrinkage coefficient in the molten state is significantly larger than that of the metal powder should be mixed evenly according to the molecular weight molar ratio: metal powder 1: plastic 2 or more, then heated to the molten state and then rapidly cooled. Step 3, melt the plastic with a solvent, Repeatedly wash the metal powder with water and then dry it; ③Using the metal cold spray process to deposit a layer of cold spray metal deposition layer on one or both sides of the substrate layer to make a FCCL flexible copper clad laminate. The FCCL flexible copper clad laminate has a simple manufacturing process and superior performance.

Description

technical field [0001] The invention relates to a FCCL flexible copper clad laminate and a manufacturing method thereof, in particular to an FCCL adhesive-free polyimide flexible copper clad laminate based on a metal cold spraying process and a manufacturing method thereof. Background technique [0002] FCCL flexible copper clad laminate is the main raw material in the FPC industry, and FPC refers to flexible printed circuit boards. With the rapid development of electronic products, traditional hard circuit boards can no longer meet the needs of industry development. Flexible printed circuit boards stand out for their advantages of lightness, lightness, convenient processing, high efficiency, and bendability. After more than 30 years of development, they have been completely Mature, the market is very huge, China is currently the largest producer of FPC flexible printed circuit boards. All FPC industries basically use FCCL flexible copper-clad laminates as the main material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03H05K1/09H05K3/02C23C24/04B22F1/00
CPCH05K1/032H05K1/09H05K3/022C23C24/04H05K2201/0154B22F1/14B22F1/142
Inventor 蒋俊
Owner 江苏百旭电子新材料科技有限公司
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