Wafer defect detection equipment

Abstract

The invention discloses wafer defect detection equipment, which comprises a wafer carrying platform which is used for fixing a to-be-detected wafer; the image acquisition module comprises a camera array, and the image acquisition module obtains a detection image corresponding to the whole surface of the to-be-detected wafer through one-time shooting of the camera array; and the defect judging module is used for judging whether the surface of the wafer to be detected has defects or not according to the detection image obtained by the image obtaining module. According to the wafer defect detection equipment, the defect detection efficiency is improved; the size occupied by the wafer defect detection equipment is reduced; the power consumption is reduced; and the cost is reduced.

Description

technical field [0001] The invention relates to the field of wafer defect detection, in particular to a high-speed wafer detection device. Background technique [0002] With the rapid development of semiconductor manufacturing technology, in order to achieve faster computing speed, larger storage capacity and more functions of semiconductor devices, semiconductor chips are developing towards higher integration; and the higher the integration of semiconductor chips, the The critical dimension (CD, Critical Dimension) of the semiconductor device is smaller. [0003] Photolithography is the most important process in semiconductor integrated production. Multi-layer processes are required in the production of integrated circuits, and each layer must be accurately aligned. After the development process is completed, the chip must be inspected after development (After Develop Inspection, ADI). The post-development inspection can find errors in the photolithography process and corr...

AI Technical Summary

Problems solved by technology

[0004] Existing post-development inspections are carried out through detection equipment, specifically through optical magnifying glass scanning on the detection equipment. The existing detection and scanning methods have low detection efficiency, low output per unit time, and relatively lagging data processing. In the optical magnifying glass scanning method, the equipment needs to be equipped with a larger magnifying glass, a larger stage and a driving device for the stage, so that the detection equipment occupies a large area and is expensive

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